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TMP302DQDRLRQ1 データシート(PDF) 9 Page - Texas Instruments

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部品番号 TMP302DQDRLRQ1
部品情報  TMP302-Q1, Automotive Grade, Low-Power, Easy-to-Use, Temperature Switch in MicroPackage
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メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
Logo TI1 - Texas Instruments

TMP302DQDRLRQ1 データシート(HTML) 9 Page - Texas Instruments

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TMP302-Q1
TRIPSET0
TRIPSET1
HYSTSET
GND
VS
OUT
0.1 µF
OUTPUT
VS
1.4 V to 3.6 V
10 k
TMP302-Q1
www.ti.com
SLOS889B – OCTOBER 2014 – REVISED JULY 2015
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
9.1.1 Configuring the TMP302-Q1
The TMP302-Q1 family of devices is simple to configure. The only external components that the device requires
are a bypass capacitor and pullup resistor. Power-supply bypassing is strongly recommended. Use a 0.1-µF
capacitor placed as close as possible to the supply pin. To minimize the internal power dissipation of the
TMP302-Q1 family of devices, use a pullup resistor value greater than 10 k
Ω from the OUT pin to the VS pin.
Refer to Table 1 for trip-point temperature configuration. The TRIPSET pins can be toggled dynamically;
however, the voltage of these pins must not exceed VS. To ensure a proper logic high, the voltage must not drop
below 0.7 V × VS.
9.2 Typical Application
Figure 10 shows the typical circuit configuration for the TMP302-Q1 family of devices. The TMP302-Q1 family of
devices is configured for the default temperature threshold by connecting the TRIPSET0 and TRIPSET1 pins
directly to ground. Connecting the HYSTSET pin to ground configures the device for 5°C of hysteresis. Place a
10-k
Ω pullup resistor between the OUT and VS pins. Place a 0.1-µF bypass capacitor between the VS pin and
ground, close to the TMP302-Q1 device.
Figure 10. TMP302-Q1 Typical Application Schematic
Figure 11 shows the most generic implementation of the TMP302-Q1 family of devices. Switches are shown
connecting the TMPSET0, TMPSET1 and HYSTSET pins to either VS or ground. The use of switches is not
strictly required; the switches are shown only to illustrate the various pin connection combinations. In practice,
connecting the TMPSET0, TMPSET1 and HYSTSET pins to ground or directly to the VS pin is sufficient and
minimizes space and cost. If additional flexibility is desired, connections from the TMPSET0, TMPSET1 and
HYSTSET pins can be made through 0-
Ω resistors which can be either populated or not populated depending
upon the desired connection.
Copyright © 2014–2015, Texas Instruments Incorporated
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