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UA741MJB データシート(PDF) 10 Page - Texas Instruments |
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UA741MJB データシート(HTML) 10 Page - Texas Instruments |
10 / 28 page BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJmax = 150°C. TOLERANCES ARE ± 10%. ALL DIMENSIONS ARE IN MILS. + – OUT IN + IN – VCC+ (7) (3) (2) (6) (4) VCC – (5) (1) OFFSET N2 OFFSET N1 45 36 (1) (8) (7) (6) (5) (4) (3) (2) uA741 SLOS094E – NOVEMBER 1970 – REVISED JANUARY 2015 www.ti.com 8.3 Feature Description 8.3.1 Offset-Voltage Null Capability The input offset voltage of operational amplifiers (op amps) arises from unavoidable mismatches in the differential input stage of the op-amp circuit caused by mismatched transistor pairs, collector currents, current- gain betas ( β), collector or emitter resistors, etc. The input offset pins allow the designer to adjust for these mismatches by external circuitry. See the Application and Implementation section for more details on design techniques. 8.3.2 Slew Rate The slew rate is the rate at which an operational amplifier can change its output when there is a change on the input. The µA741 has a 0.5-V/ μs slew rate. Parameters that vary significantly with operating voltages or temperature are shown in the Typical Characteristics graphs. 8.4 Device Functional Modes The µA741 is powered on when the supply is connected. It can be operated as a single supply operational amplifier or dual supply amplifier depending on the application. 8.5 µA741Y Chip Information This chip, when properly assembled, displays characteristics similar to the µA741C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. 10 Submit Documentation Feedback Copyright © 1970–2015, Texas Instruments Incorporated Product Folder Links: uA741 |
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