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TPA6133A2RTJR データシート(PDF) 3 Page - Texas Instruments |
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TPA6133A2RTJR データシート(HTML) 3 Page - Texas Instruments |
3 / 26 page 1 2 3 4 5 6 7 8 9 10 15 14 13 12 11 20 19 18 17 16 Top View LEFTINM LEFTINP GND RIGHTINP RIGHTINM HPRIGHT VDD GND HPLEFT CPVSS TPA6133A2 www.ti.com SLOS821B – JUNE 2013 – REVISED SEPTEMBER 2014 6 Pin Configuration and Functions RTJ Package (Top VIEW) Pin Functions PIN INPUT, OUTPUT, DESCRIPTION NAME NUMBER POWER Left channel negative differential input. Impedance must be matched to LEFTINP. Connect the left LEFTINM 1 I input to LEFTINM when using single-ended inputs. Left channel positive differential input. Impedance must be matched to LEFTINM. AC ground LEFTINP 2 I LEFTINP near signal source while maintaining matched impedance to LEFTINM when using single- ended inputs. Right channel positive differential input. Impedance must be matched to RIGHTINM. AC ground RIGHTINP 4 I RIGHTINP near signal source while maintaining matched impedance to RIGHTINM when using single-ended inputs. Analog ground. Must be connected to common supply GND. It is recommended that this pin be GND 3, 9, 10, 13 P used to decouple VDD for analog. Use pin 13 to decouple pin 12 on the QFN package. Right channel negative differential input. Impedance must be matched to RIGHTINP. Connect the RIGHTINM 5 I right input to RIGHTINM when using single-ended inputs. SD 6 I Shutdown. Active low logic. 5V tolerant input. TEST2 7 I Factory test pins. Pull up to VDD supply. See Applications Diagram. TEST1 8 I Factory test pins. Pull up to VDD supply. See Applications Diagram. HPRIGHT 11 O Headphone light channel output. Connect to the right terminal of the headphone jack. Analog VDD. VDD must be connected to common VDD supply. Decouple with its own 1-μF capacitor VDD 12 P to analog ground (pin 13). HPLEFT 14 O Headphone left channel output. Connect to left terminal of headphone jack. Negative supply generated by the charge pump. Decouple to pin 19 or a GND plane. Use a 1 μF CPVSS 15, 16 P capacitor. CPN 17 P Charge pump flying capacitor negative terminal. Connect one side of the flying capacitor to CPN. CPP 18 P Charge pump flying capacitor positive terminal. Connect one side of the flying capacitor to CPP. Charge pump ground. GND must be connected to common supply GND. It is recommended that GND 19 P this pin be decoupled to the VDD of the charge pump pin (pin 20 on the QFN). Charge pump voltage supply. VDD must be connected to the common VDD voltage supply. Decouple VDD 20 P to GND (pin 19 ) with its own 1 μF capacitor. Solder the thermal pad on the bottom of the QFN package to the GND plane of the PCB. It is Thermal pad Die Pad P required for mechanical stability and will enhance thermal performance. Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: TPA6133A2 |
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