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TPA6120A2RGYR データシート(PDF) 2 Page - Texas Instruments

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部品番号 TPA6120A2RGYR
部品情報  High Fidelity Headphone Amplifier
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メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
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TPA6120A2RGYR データシート(HTML) 2 Page - Texas Instruments

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TPA6120A2
SLOS431B – MARCH 2004 – REVISED FEBRUARY 2015
www.ti.com
Table of Contents
9.3
Feature Description................................................... 8
1
Features .................................................................. 1
9.4
Device Functional Modes.......................................... 9
2
Applications ........................................................... 1
10
Applications and Implementation........................ 9
3
Description ............................................................. 1
10.1
Application Information............................................ 9
4
Simplified Schematic............................................. 1
10.2
Typical Application .................................................. 9
5
Revision History..................................................... 2
11
Power Supply Recommendations ..................... 16
6
Pin Configuration and Functions ......................... 3
11.1
Independent Power Supplies ................................ 16
7
Specifications......................................................... 4
11.2
Power Supply Decoupling ..................................... 16
7.1
Absolute Maximum Ratings ...................................... 4
12
Layout................................................................... 17
7.2
ESD Ratings.............................................................. 4
12.1
Layout Guidelines ................................................. 17
7.3
Recommended Operating Conditions ....................... 4
12.2
Layout Example .................................................... 18
7.4
Thermal Information .................................................. 4
13
Device and Documentation Support ................. 20
7.5
Electrical Characteristics........................................... 5
13.1
Documentation Support ........................................ 20
7.6
Operating Characteristics.......................................... 5
13.2
Trademarks ........................................................... 20
7.7
Typical Characteristics .............................................. 6
13.3
Electrostatic Discharge Caution ............................ 20
8
Parameter Measurement Information .................. 8
13.4
Glossary ................................................................ 20
9
Detailed Description .............................................. 8
14
Mechanical, Packaging, and Orderable
9.1
Overview ................................................................... 8
Information ........................................................... 20
9.2
Functional Block Diagram ......................................... 8
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (July 2014) to Revision B
Page
Changed the Device Information Packages From: DWP (20) and RGY (14) To: HSOP (20) and VQFN (14) ..................... 1
Changed QFN to VQFN in the Pin Functions table ............................................................................................................... 3
Added a NOTE to the Applications and Implementation section ........................................................................................... 9
Added Title: Application Information....................................................................................................................................... 9
Deleted Title: Application Circuit............................................................................................................................................. 9
Changed the Design Requirements ..................................................................................................................................... 10
Deleted Title: Application Circuit........................................................................................................................................... 14
Moved two paragraphs following Figure 19 to proceed Figure 19 ....................................................................................... 14
Changes from Original (March 2004) to Revision A
Page
Changed Added ESD Rating table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1
Added the VQFN package information .................................................................................................................................. 1
Updated Pin descriptions to clarify power supply. ................................................................................................................. 3
Lowered minimum VIC(±5Vcc) From: ±3.6 To: ±3.4 .............................................................................................................. 5
Lowered minimum VIC(±15Vcc) From: ±13.4V To: ±13.2V ................................................................................................... 5
Deleted IMD (Intermodulation Distortion), ±12Vcc data, Dynamic Range (replaced with SNR, in 1V/V gain) ...................... 5
Changed the THD=N UNIT From: % To: dB .......................................................................................................................... 5
Changed the SNR to show the latest data from newer QFN based EVM. ........................................................................... 5
2
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