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TPL5111 データシート(PDF) 4 Page - Texas Instruments

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部品番号 TPL5111
部品情報  Nano-Power System Timer for Power Gating
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メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
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TPL5111
SNAS659A – JUNE 2015 – REVISED JULY 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
(1)
MIN
MAX
UNIT
Supply Voltage (VDD-GND)
-0.3
6.0
V
Input Voltage at any pin(2)
-0.3
VDD + 0.3
V
Input Current on any pin
-5
5
mA
Storage Temperature, Tstg
-65
150
°C
Junction Temperature, TJ
(3)
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The voltage between any two pins should not exceed 6V.
(3)
The maximum power dissipation is a function of TJ(MAX), RθJA, and the ambient temperature, TA. The maximum allowable power
dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ RθJA. All numbers apply for packages soldered directly onto a PC
board.
6.2 ESD Ratings
VALUE
UNIT
Human Body Model, per ANSI/ESDA/JEDEC JS-001(1)
±1000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-101(2)
±250
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Ratings
MIN
MAX
UNIT
Supply Voltage (VDD-GND)
1.8
5.5
V
Temperature
-40
105
°C
6.4 Thermal Information
TPL5111
THERMAL METRIC(1)
SOT23
UNIT
DDC 6 PINS
RθJA
Junction-to-ambient thermal resistance
163
RθJC(top)
Junction-to-case (top) thermal resistance
26
RθJB
Junction-to-board thermal resistance
57
°C/W
ψJT
Junction-to-top characterization parameter
7.5
ψJB
Junction-to-board characterization parameter
57
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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Copyright © 2015, Texas Instruments Incorporated
Product Folder Links: TPL5111


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