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TPL5111 データシート(PDF) 4 Page - Texas Instruments |
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TPL5111 データシート(HTML) 4 Page - Texas Instruments |
4 / 25 page TPL5111 SNAS659A – JUNE 2015 – REVISED JULY 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) MIN MAX UNIT Supply Voltage (VDD-GND) -0.3 6.0 V Input Voltage at any pin(2) -0.3 VDD + 0.3 V Input Current on any pin -5 5 mA Storage Temperature, Tstg -65 150 °C Junction Temperature, TJ (3) 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The voltage between any two pins should not exceed 6V. (3) The maximum power dissipation is a function of TJ(MAX), RθJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ RθJA. All numbers apply for packages soldered directly onto a PC board. 6.2 ESD Ratings VALUE UNIT Human Body Model, per ANSI/ESDA/JEDEC JS-001(1) ±1000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22-101(2) ±250 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Ratings MIN MAX UNIT Supply Voltage (VDD-GND) 1.8 5.5 V Temperature -40 105 °C 6.4 Thermal Information TPL5111 THERMAL METRIC(1) SOT23 UNIT DDC 6 PINS RθJA Junction-to-ambient thermal resistance 163 RθJC(top) Junction-to-case (top) thermal resistance 26 RθJB Junction-to-board thermal resistance 57 °C/W ψJT Junction-to-top characterization parameter 7.5 ψJB Junction-to-board characterization parameter 57 RθJC(bot) Junction-to-case (bottom) thermal resistance N/A (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: TPL5111 |
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