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TPD4E02B04

SLVSD85A – NOVEMBER 2015 – REVISED FEBRUARY 2016

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Copyright © 2015–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Electrical Fast Transient

IEC 61000-4-5 (5/50 ns)

80

A

Peak Pulse

17

W

2

A

Operating free-air temperature

–40

125

°C

Storage temperature

–65

155

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2500

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1000

IEC 61000-4-2 contact discharge

±12000

IEC 61000-4-2 air-gap discharge

±15000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input pin voltage

–3.6

3.6

V

Operating free-air temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

TPD4E02B04

UNIT

DQA (USON)

10 PINS

Junction-to-ambient thermal resistance

348.7

°C/W

Junction-to-case (top) thermal resistance

214.1

°C/W

Junction-to-board thermal resistance

270.7

°C/W

Junction-to-top characterization parameter

81.7

°C/W

Junction-to-board characterization parameter

270.7

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W