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IRFP4668PBF データシート(PDF) 2 Page - Kersemi Electronic Co., Ltd. |
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IRFP4668PBF データシート(HTML) 2 Page - Kersemi Electronic Co., Ltd. |
2 / 8 page S D G Notes: Repetitive rating; pulse width limited by max. junction temperature. Limited by TJmax, starting TJ = 25°C, L = 0.23mH RG = 25Ω, IAS = 81A, VGS =10V. Part not recommended for use above this value. ISD ≤ 81A, di/dt ≤ 520A/μs, VDD ≤ V(BR)DSS, TJ ≤ 175°C. Pulse width ≤ 400μs; duty cycle ≤ 2%.
Coss eff. (TR) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS. Coss eff. (ER) is a fixed capacitance that gives the same energy as Coss while VDS is rising from 0 to 80% VDSS. When mounted on 1" square PCB (FR-4 or G-10 Material). For recom mended footprint and soldering techniques refer to application note #AN-994. Rθ is measured at TJ approximately 90°C. Static @ TJ = 25°C (unless otherwise specified) Symbol Parameter Min. Typ. Max. Units V(BR)DSS Drain-to-Source Breakdown Voltage 200 ––– ––– V ΔV(BR)DSS/ΔTJ Breakdown Voltage Temp. Coefficient ––– 0.21 ––– V/°C RDS(on) Static Drain-to-Source On-Resistance ––– 8.0 9.7 m Ω VGS(th) Gate Threshold Voltage 3.0 ––– 5.0 V IDSS Drain-to-Source Leakage Current ––– ––– 20 μA ––– ––– 250 IGSS Gate-to-Source Forward Leakage ––– ––– 100 nA Gate-to-Source Reverse Leakage ––– ––– -100 RG Internal Gate Resistance ––– 1.0 ––– Ω Dynamic @ TJ = 25°C (unless otherwise specified) Symbol Parameter Min. Typ. Max. Units gfs Forward Transconductance 150 ––– ––– S Qg Total Gate Charge ––– 161 241 nC Qgs Gate-to-Source Charge ––– 54 ––– Qgd Gate-to-Drain ("Miller") Charge ––– 52 ––– Qsync Total Gate Charge Sync. (Qg - Qgd) ––– 109 ––– td(on) Turn-On Delay Time ––– 41 ––– ns tr Rise Time ––– 105 ––– td(off) Turn-Off Delay Time ––– 64 ––– tf Fall Time ––– 74 ––– Ciss Input Capacitance ––– 10720 ––– Coss Output Capacitance ––– 810 ––– Crss Reverse Transfer Capacitance ––– 160 ––– pF Coss eff. (ER) Effective Output Capacitance (Energy Related)h ––– 630 ––– Coss eff. (TR) Effective Output Capacitance (Time Related)g ––– 790 ––– Diode Characteristics Symbol Parameter Min. Typ. Max. Units IS Continuous Source Current ––– ––– 130 A (Body Diode) ISM Pulsed Source Current ––– ––– 520 (Body Diode) c VSD Diode Forward Voltage ––– ––– 1.3 V trr Reverse Recovery Time ––– 130 ––– ns TJ = 25°C VR = 100V, ––– 155 ––– TJ = 125°C IF = 81A Qrr Reverse Recovery Charge ––– 633 ––– nC TJ = 25°C di/dt = 100A/μs f ––– 944 ––– TJ = 125°C IRRM Reverse Recovery Current ––– 8.7 ––– A TJ = 25°C ton Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD) ID = 81A RG = 2.7Ω VGS = 10V f VDD = 130V ID = 81A, VDS =0V, VGS = 10V TJ = 25°C, IS = 81A, VGS = 0V f integral reverse p-n junction diode. Conditions VGS = 0V, ID = 250μA Reference to 25°C, ID = 5mA c VGS = 10V, ID = 81A f VDS = VGS, ID = 250μA VDS = 200V, VGS = 0V VDS = 200V, VGS = 0V, TJ = 125°C MOSFET symbol showing the VDS = 100V Conditions VGS = 10V f VGS = 0V VDS = 50V ƒ = 1.0MHz VGS = 0V, VDS = 0V to 160V h VGS = 0V, VDS = 0V to 160V g Conditions VDS = 50V, ID = 81A ID = 81A VGS = 20V VGS = -20V IRFP4668PBF 2014-8-14 2 www.kersemi.com |
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