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AD6649EBZ データシート(PDF) 10 Page - Analog Devices |
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AD6649EBZ データシート(HTML) 10 Page - Analog Devices |
10 / 40 page AD6649 Data Sheet Rev. C | Page 10 of 40 ABSOLUTE MAXIMUM RATINGS Table 6. Parameter Rating Electrical AVDD to AGND −0.3 V to +2.0 V DRVDD to AGND −0.3 V to +2.0 V VIN+A/VIN+B, VIN−A/VIN−B to AGND −0.3 V to AVDD + 0.2 V CLK+, CLK− to AGND −0.3 V to AVDD + 0.2 V SYNC to AGND −0.3 V to AVDD + 0.2 V VCM to AGND −0.3 V to AVDD + 0.2 V CSB to AGND −0.3 V to DRVDD + 0.3 V SCLK to AGND −0.3 V to DRVDD + 0.3 V SDIO to AGND −0.3 V to DRVDD + 0.3 V OEB to AGND −0.3 V to DRVDD + 0.3 V PDWN to AGND −0.3 V to DRVDD + 0.3 V D0−/D0+ through D13−/D13+ to AGND −0.3 V to DRVDD + 0.3 V FDA/FDB to AGND −0.3 V to DRVDD + 0.3 V OR+/OR− to AGND −0.3 V to DRVDD + 0.3 V DCO+/DCO− to AGND −0.3 V to DRVDD + 0.3 V Environmental Operating Temperature Range (Ambient) −40°C to +85°C Maximum Junction Temperature Under Bias 150°C Storage Temperature Range (Ambient) −65°C to +125°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL CHARACTERISTICS The exposed paddle must be soldered to the ground plane for the LFCSP package. Soldering the exposed paddle to the customer board increases the reliability of the solder joints, maximizing the thermal capability of the package. Table 7. Thermal Resistance Package Type Airflow Velocity (m/sec) θJA1,2 θJC1,3 θJB1,4 Unit 64-Lead LFCSP 9 mm × 9 mm (CP-64-4) 0 26.8 1.14 10.4 °C/W 1.0 21.6 °C/W 2.0 20.2 °C/W 1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board. 2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air). 3 Per MIL-Std 883, Method 1012.1. 4 Per JEDEC JESD51-8 (still air). Typical θJA is specified for a 4-layer PCB with solid ground plane. As shown in Table 7, airflow increases heat dissipation, which reduces θJA. In addition, metal in direct contact with the package leads from metal traces, through holes, ground, and power planes, reduces the θJA. ESD CAUTION |
同様の部品番号 - AD6649EBZ |
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同様の説明 - AD6649EBZ |
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