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LM1117IMPX-ADJ データシート(Datasheet) 4 Page - Texas Instruments

部品番号. LM1117IMPX-ADJ
部品情報  800-mA Low-Dropout Linear Regulator
ダウンロード  36 Pages
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メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
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LM1117
SNOS412N – FEBRUARY 2000 – REVISED JANUARY 2016
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Maximum Input Voltage (VIN to GND)
20
V
Power Dissipation(2)
Internally Limited
Junction Temperature (TJ)
(2)
150
°C
TO-220 (T) Package, 10 s
260
Lead Temperature
°C
SOT-223 (MP) Package, 4 s
260
Storage Temperature, Tstg
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The maximum power dissipation is a function of TJ(max) , RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–TA)/RθJA. All numbers apply for packages soldered directly into a PCB.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as ±2000
V may actually have higher performance.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Input Voltage (VIN to GND)
15
V
LM1117
0
125
°C
Junction Temperature (TJ)
(1)
LM1117I
−40
125
(1)
The maximum power dissipation is a function of TJ(max) , RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–TA)/RθJA. All numbers apply for packages soldered directly into a PCB.
6.4 Thermal Information
LM1117, LM1117I
DCY
NDE
NDP
NGN
KTT
THERMAL METRIC(1)
UNIT
(SOT-223)
(TO-220)
(TO-252)
(WSON)
(TO-263)
4 PINS
3 PINS
3 PINS
8 PINS
3 PINS
RθJA
Junction-to-ambient thermal resistance
61.6
23.8
45.1
39.3
41.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
42.5
16.6
52.1
31.4
44.1
°C/W
RθJB
Junction-to-board thermal resistance
10.4
5.3
29.8
16.5
24.2
°C/W
ψJT
Junction-to-top characterization parameter
2.9
3.1
4.5
0.3
10.9
°C/W
ψJB
Junction-to-board characterization parameter
10.3
5.3
29.4
16.7
23.2
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
1.5
1.3
5.6
1.3
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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Copyright © 2000–2016, Texas Instruments Incorporated
Product Folder Links: LM1117




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