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LM3691TL-1.2 データシート(PDF) 5 Page - Texas Instruments

部品番号 LM3691TL-1.2
部品情報  High-Accuracy, Miniature 1-A Step-Down DC-DC Converter
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メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
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LM3691TL-1.2 データシート(HTML) 5 Page - Texas Instruments

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LM3691
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SNVS506J – MAY 2008 – REVISED DECEMBER 2015
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
VIN pin to GND
−0.2
6
V
EN, MODE, FB, SW pins
(GND
− 0.2)
VIN + 0.2
V
Junction temperature (TJ-MAX)
150
°C
Continuous power dissipation(3)
Internally Limited
Maximum lead temperature (soldering, 10 seconds)
260
°C
Storage temperature, Tstg
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
If Military/Aerospace specified devices are required, contact the TI Sales Office/Distributors for availability and specifications.
(3)
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typical) and
disengages at TJ = 130°C (typical).
7.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V(ESD)
Electrostatic discharge
V
Machine model
±200
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
Input voltage
2.3
5.5
V
Recommended load current
0
1000
mA
Junction temperature, TJ
−30
125
°C
Ambient temperature, TA
(1)
−30
85
°C
(1)
In applications where high power dissipation and/or poor package resistance is present, the maximum ambient temperature may have to
be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX), the
maximum power dissipation of the device in the application (PD-MAX) and the junction to ambient thermal resistance of the package
(RθJA) in the application, as given by the following equation: TA-MAX = TJ-MAX − (RθJA × PD-MAX). Due to the pulsed nature of testing the
part, the temp in Electrical Characteristics is specified as TA = TJ.
7.4 Thermal Information
LM3691
THERMAL METRIC(1)
YZR (DSBGA)
UNIT
6 PINS
RθJA
Junction-to-ambient thermal resistance(2)
85
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2)
Junction-to-ambient thermal resistance is highly application and board layout dependent. In applications where high power dissipation
exists, special care must be given to thermal dissipation issues in board design.
Copyright © 2008–2015, Texas Instruments Incorporated
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