TLP2301

8

12.

12.

12.

12. Soldering and Storage

Soldering and Storage

Soldering and Storage

Soldering and Storage

12.1.

12.1.

12.1.

12.1. Precautions for Soldering

Precautions for Soldering

Precautions for Soldering

Precautions for Soldering

The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective

of whether a soldering iron or a reflow soldering method is used.

•

When using soldering reflow.

The soldering temperature profile is based on the package surface temperature.

(See the figure shown below, which is based on the package surface temperature.)

Reflow soldering must be performed once or twice.

The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

An Example of a Temperature Profile

An Example of a Temperature Profile

An Example of a Temperature Profile

An Example of a Temperature Profile

When Lead(Pb)-Free Solder Is Used

When Lead(Pb)-Free Solder Is Used

When Lead(Pb)-Free Solder Is Used

When Lead(Pb)-Free Solder Is Used

•

When using soldering flow

Preheat the device at a temperature of 150  (package surface temperature) for 60 to 120 seconds.

Mounting condition of 260  within 10 seconds is recommended.

Flow soldering must be performed once.

•

When using soldering Iron

Complete soldering within 10 seconds for lead temperature not exceeding 260  or within 3 seconds not

exceeding 350 

Heating by soldering iron must be done only once per lead.

12.2.

12.2.

12.2.

12.2. Precautions for General Storage

Precautions for General Storage

Precautions for General Storage

Precautions for General Storage

•

Avoid storage locations where devices may be exposed to moisture or direct sunlight.

•

Follow the precautions printed on the packing label of the device for transportation and storage.

•

Keep the storage location temperature and humidity within a range of 5  to 35  and 45 % to 75 %,

respectively.

•

Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty

conditions.

•

Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during

storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the

solderability of the leads.

•

When restoring devices after removal from their packing, use anti-static containers.

•

Do not allow loads to be applied directly to devices while they are in storage.

•

If devices have been stored for more than two years under normal storage conditions, it is recommended

that you check the leads for ease of soldering prior to use.

2016-01-13

Rev.3.0

©2016 Toshiba Corporation