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SN74CBTLV3253DG4 データシート(PDF) 4 Page - Texas Instruments

部品番号 SN74CBTLV3253DG4
部品情報  FET Multiplexer/Demultiplexer
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SN74CBTLV3253DG4 データシート(HTML) 4 Page - Texas Instruments

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SN74CBTLV3253
SCDS039I – DECEMBER 1997 – REVISED SEPTEMBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VCC
Supply voltage
–0.5
4.6
V
VIN
Control input voltage(2)
–0.5
4.6
V
VI/O
Switch I/O voltage(2)
–0.5
4.6
V
IIK
Control input clamp current
VIN < 0
–50
mA
II/OK
I/O port clamp current
VI/O < 0
–50
mA
Continuous current through VCC or GND
±128
mA
TJ
Junction temperature
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
6.2 ESD Ratings
VALUE
UNIT
Human Body Model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
+2000
V
Electrostatic
VESD
Charged-Device Model (CDM), per JEDEC specification JESD22-C101, all
discharge
+1000
V
pins(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VCC
Supply voltage
2.3
3.6
V
VCC = 2.3 V to 2.7 V
1.7
VIH
High-level control input voltage
V
VCC = 2.7 V to 3.6 V
2
VCC = 2.3 V to 2.7 V
0.7
VIL
Low-level control input voltage
V
VCC = 2.7 V to 3.6 V
0.8
TA
Operating free-air temperature
–40
85
°C
(1)
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, SCBA004.
6.4 Thermal Information
SN74CBTLV3253
D
DBQ
DGV
PW
RGY
THERMAL METRIC(1)
UNIT
(SOIC)
(SSOP)
(TVSOP)
(TSSOP)
(VQFN)
16 PINS
16 PINS
16 PINS
16 PINS
16 PINS
RθJA
Junction-to-ambient thermal resistance
73
90
120
108
39
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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Copyright © 1997–2015, Texas Instruments Incorporated
Product Folder Links: SN74CBTLV3253


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