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SN74CBTLV3253DRE4 データシート(PDF) 4 Page - Texas Instruments |
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SN74CBTLV3253DRE4 データシート(HTML) 4 Page - Texas Instruments |
4 / 27 page SN74CBTLV3253 SCDS039I – DECEMBER 1997 – REVISED SEPTEMBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage –0.5 4.6 V VIN Control input voltage(2) –0.5 4.6 V VI/O Switch I/O voltage(2) –0.5 4.6 V IIK Control input clamp current VIN < 0 –50 mA II/OK I/O port clamp current VI/O < 0 –50 mA Continuous current through VCC or GND ±128 mA TJ Junction temperature 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 6.2 ESD Ratings VALUE UNIT Human Body Model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) +2000 V Electrostatic VESD Charged-Device Model (CDM), per JEDEC specification JESD22-C101, all discharge +1000 V pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage 2.3 3.6 V VCC = 2.3 V to 2.7 V 1.7 VIH High-level control input voltage V VCC = 2.7 V to 3.6 V 2 VCC = 2.3 V to 2.7 V 0.7 VIL Low-level control input voltage V VCC = 2.7 V to 3.6 V 0.8 TA Operating free-air temperature –40 85 °C (1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, SCBA004. 6.4 Thermal Information SN74CBTLV3253 D DBQ DGV PW RGY THERMAL METRIC(1) UNIT (SOIC) (SSOP) (TVSOP) (TSSOP) (VQFN) 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS RθJA Junction-to-ambient thermal resistance 73 90 120 108 39 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 1997–2015, Texas Instruments Incorporated Product Folder Links: SN74CBTLV3253 |
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