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TS12A44513 データシート(PDF) 4 Page - Texas Instruments |
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TS12A44513 データシート(HTML) 4 Page - Texas Instruments |
4 / 24 page 4 TS12A44513, TS12A44514, TS12A44515 SCDS247B – OCTOBER 2008 – REVISED FEBRUARY 2016 www.ti.com Product Folder Links: TS12A44513 TS12A44514 TS12A44515 Submit Documentation Feedback Copyright © 2008–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum (3) Voltages referenced to GND (4) Voltages exceeding VCC or GND on any signal terminal are clamped by internal diodes. Limit forward-diode current to maximum current rating. 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) (3) MIN MAX UNIT VCC Supply voltage –0.3 13 V VNC VNO VCOM Analog voltage(4) –0.3 VCC + 0.3 V INC INO ICOM IIN Analog current -20 20 mA Peak current (pulsed at 1 ms, 10% duty cycle) ±30 mA TA Operating temperature –40 85 °C PD Power dissipation Mounted on JEDEC 4-layer board (JESD 51-7), No airflow, TA = 25°C, TJ = 125°C PW package 0.88 W Tstg Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±500 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC 2 12 V VNC, VNO, VCOM, VIN 0 VCC V (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) TS12A44513, TS12A44514, TS12A44515 UNIT D PW 14 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 89.8 119.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 49.6 48.4 RθJB Junction-to-board thermal resistance 44.4 61.3 ψJT Junction-to-top characterization parameter 13.8 5.7 ψJB Junction-to-board characterization parameter 44.1 60.7 |
同様の部品番号 - TS12A44513_16 |
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同様の説明 - TS12A44513_16 |
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