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FAN5307MPX データシート(PDF) 3 Page - Fairchild Semiconductor |
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FAN5307MPX データシート(HTML) 3 Page - Fairchild Semiconductor |
3 / 13 page 3 www.fairchildsemi.com FAN5307 Rev. 1.0.4 Absolute Maximum Ratings Recommended Operating Conditions Notes: 1. Junction to ambient thermal resistance, θ JA, is a strong function of PCB material, board thickness, thickness and number of copper planes, number of vias used, diameter of via used, available copper surface, and attached heat sink characteristics. 2. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model). 3. Refer to the applications section for further details. Parameter Min Max Unit VIN -0.3 6.5 V Voltage on any other pin GND-0.3 VIN + 0.3 V Thermal Resistance (Note 1) Junction to case, SOT-23 130 °C/W Junction to tab, MLP 3x3 8 Lead Soldering Temperature (10 seconds) 260 °C Storage Temperature -65 150 °C Electrostatic Discharge (ESD) Protection Level (Note 2) HBM 4 kV CDM 1 Parameter Min Typ Max Unit Supply Voltage Range 2.5 5.5 V Output Voltage Range, Adjustable Version 0.7 VIN V Output Current 300 mA Inductor (Note 3) 10 µH Input Capacitor (Note 3) 4.7 µF Output Capacitor (Note 3) 10 µF Operating Ambient Temperature Range -40 +85 °C Operating Junction Temperature Range -40 +125 °C |
同様の部品番号 - FAN5307MPX |
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同様の説明 - FAN5307MPX |
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