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MAX11312 データシート(PDF) 3 Page - Maxim Integrated Products |
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MAX11312 データシート(HTML) 3 Page - Maxim Integrated Products |
3 / 54 page DVDD to DGND.......................................................-0.3V to +6V AVDD to AGND .......................................................-0.3V to +6V AVDDIO to AVSSIO...............................................-0.3V to +25V AVDDIO to AGND..................................................-0.3V to +17V AVSSIO to AGND..................................................-14V to +0.3V AGND to AGND1..................................................-0.3V to +0.3V AGND to DGND ...................................................-0.3V to +0.3V AGND1 to DGND .................................................-0.3V to +0.3V (PORT0 to PORT11) to AGND ............max of (VAVSSIO - 0.3V) or -14V to min of (VAVDDIO + 0.3V) or +17V (PORT0 to PORT11) to AGND (GPI and Bidirectional Level Translator Modes) ........-0.3V to min of (VAVDD + 0.3V) or +6V CNVT to DGND.............-0.3V to min of (VDVDD + 0.3V) or +6V INT to DGND...........................................................-0.3V to +6V (SDA, SCL) to DGND..............................................-0.3V to +6V (AD0, AD1) to DGND ....-0.3V to min of (VDVDD + 0.3V) or +6V DAC and ADC Reference Pins to AGND (DAC_REF, ADC_INT_REF,) .......... -0.3V to min of (VAVDD +0.3V) or +4V Temperature Sensor Pins (D0N, D0P, D1N, D1P) to AGND..........................-0.3V to min of (VAVDD + 0.3V) or +6V Current into Any PORT Pin ..............................................100mA Current into Any Other Pin Except Supplies and Ground.....................................................................50mA Continuous Power Dissipation (TA = +70°C) (Multilayer board) TQFN (derate 34.5mW/°C above +70°C) .............2758.6mW Operating Temperature Range..........................-40ºC to +105°C Storage Temperature Range.............................-65ºC to +150°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow).......................................+260°C TQFN Junction-to-Case Thermal Resistance (θJC)..............1.7°C/W Junction-to-Ambient Thermal Resistance (θJA) ..........29°C/W (Note 1) ADC Electrical Specifications (VAVDD = 4.75V to 5.25V, VDVDD = 3.3V, VAVDDIO = +12.0V, VAGND = VDGND = 0V, VAVSSIO = -2.0V, VDACREF = 2.5V, VADCREF = 2.5V (Internal), fS = 400ksps, 10V analog input range set to range 1 (0 to +10V). TA = -40°C to +105°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2) MAX11312 PIXI, 12-Port Programmable Mixed-Signal I/O with 12-Bit ADC, 12-Bit DAC, Analog Switches, and GPIO www.maximintegrated.com Maxim Integrated │ 3 Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics Electrical Characteristics PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC ACCURACY (Note 3) Resolution 12 Bits Integral Nonlinearity INL ±2.5 LSB Differential Nonlinearity DNL No missing codes over temperature ±1 LSB Offset Error ±0.5 ±8 LSB Offset Error Drift ±0.002 LSB/°C Gain Error ±11 LSB Gain Error Drift ±0.01 LSB/°C Channel-to-Channel Offset Matching 1 LSB Channel-to-Channel Gain Matching 2 LSB |
同様の部品番号 - MAX11312 |
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同様の説明 - MAX11312 |
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