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ADC10065 データシート(PDF) 5 Page - Texas Instruments |
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ADC10065 データシート(HTML) 5 Page - Texas Instruments |
5 / 26 page ADC10065 www.ti.com SNAS225H – JULY 2003 – REVISED APRIL 2013 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) (3) VDDA, VDDIO 3.9V Voltage on Any Pin to GND −0.3V to VDDA or VDDIO +0.3V Input Current on Any Pin ±25 mA Package Input Current (4) ±50 mA Package Dissipation at T = 25°C See (5) ESD Susceptibility Human Body Model (6) 2500V Machine Model (6) 250V Soldering Temperature Infrared, 10 sec. (7) 235°C Storage Temperature −65°C to +150°C (1) All voltages are measured with respect to GND = VSSA = VSSIO = 0V, unless otherwise specified. (2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the AC Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. (3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (4) When the voltage at any pin exceeds the power supplies (VIN < VSSA or VIN > VDDA), the current at that pin should be limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 25 mA to two. (5) The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula PDMAX = (TJmax − TA)/θJA. In the 28-pin TSSOP, θJA is 96°C/W, so PDMAX = 1,302 mW at 25°C and 677 mW at the maximum operating ambient temperature of 85°C. Note that the power dissipation of this device under normal operation will typically be about 68.6 mW. The values for maximum power dissipation listed above will be reached only when the ADC10065 is operated in a severe fault condition. (6) Human body model is 100 pF capacitor discharged through a 1.5 k Ω resistor. Machine model is 220 pF discharged through 0Ω. (7) The 235°C reflow temperature refers to infrared reflow. For Vapor Phase Reflow (VPR) the following conditions apply: Maintain the temperature at the top of the package body above 183°C for a minimum of 60 seconds. The temperature measured on the package body must not exceed 220°C. Only one excursion above 183°C is allowed per reflow cycle. Operating Ratings (1) (2) Operating Temperature Range −40°C ≤ TA ≤ +85°C VDDA (Supply Voltage) +2.7V to +3.6V VDDIO (Output Driver Supply Voltage) +2.5V to VDDA VREF 1.20V |VSSA–VSSIO| ≤ 100 mV Clock Duty Cycle 30 to 70 % (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the AC Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. (2) All voltages are measured with respect to GND = VSSA = VSSIO = 0V, unless otherwise specified. Copyright © 2003–2013, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: ADC10065 |
同様の部品番号 - ADC10065_15 |
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同様の説明 - ADC10065_15 |
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