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CD74HCT4051QM96Q1 データシート(PDF) 3 Page - Texas Instruments |
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CD74HCT4051QM96Q1 データシート(HTML) 3 Page - Texas Instruments |
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3 / 12 page  CD74HCT4051-Q1 HIGH-SPEED CMOS LOGIC ANALOG MULTIPLEXER/DEMULTIPLEXER SCLS569B − JANUARY 2004 − REVISED APRIL 2008 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range: VCC − VEE (see Note 1) −0.5 V to 10.5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC −0.5 V to +7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VEE 0.5 V to −7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input clamp current, IIK (VI < −0.5 V or VI > VCC + 0.5 V) ±20 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output clamp current, IOK (VO < VEE − 0.5 V or VO > VCC + 0.5 V) ±20 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . Switch current (VI > VEE − 0.5 V or VI < VCC + 0.5 V) ±25 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous current through VCC or GND ±50 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VEE current, IEE −20 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package thermal impedance, θJA (see Note 2) 73 °C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Maximum junction temperature, TJ 150 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead temperature (during soldering): At distance 1/16 ± 1/32 inch (1,59 ± 0,79 mm) from case for 10 s max 300 °C . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, Tstg −65 °C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages referenced to GND unless otherwise specified. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) MIN MAX UNIT VCC Supply voltage 4.5 5.5 V Supply voltage, VCC − VEE (see Figure 1) 2 10 V VEE Supply voltage (see Note 4 and Figure 2) 0 −6 V VIH High-level input voltage 2 V VIL Low-level input voltage 0.8 V VI Input control voltage 0 VCC V VIS Analog switch I/O voltage VEE VCC V tt Input transition (rise and fall) time VCC = 4.5 V 0 500 ns TA Operating free-air temperature −40 125 °C NOTES: 3. All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 4. In certain applications, the external load resistor current may include both VCC and signal-line components. To avoid drawing VCC current when switch current flows into the transmission gate inputs, the voltage drop across the bidirectional switch must not exceed 0.6 V (calculated from ron values shown in electrical characteristics table). No VCC current flows through RL if the switch current flows into the COM OUT/IN A terminal. |
同様の部品番号 - CD74HCT4051QM96Q1 |
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同様の説明 - CD74HCT4051QM96Q1 |
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