DAC088S085 datasheet(4/41 Pages) TI1

部品番号	DAC088S085

部品情報	DAC088S085 8-Bit Micro Power OCTAL Digital-to-Analog Converter With Rail-to-Rail Outputs

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DAC088S085

SNAS424D – AUGUST 2007 – REVISED APRIL 2016

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(1)

WQFN only

Pin Functions

TYPE

DESCRIPTION

NAME

NO.

WQFN

TSSOP

DIN

15

1

Digital Input

Serial Data Input. Data is clocked into the 16-bit shift register on the falling edges of

SCLK after the fall of SYNC.

DOUT

16

2

Digital Output

Serial Data Output. DOUT is used in daisy chain operation and is connected directly to a

DIN pin on another DAC088S085. Data is not available at DOUT unless SYNC remains

low for more than 16 SCLK cycles.

GND

8

10

Ground

Ground reference for all on-chip circuitry.

SCLK

14

16

Digital Input

Serial Clock Input. Data is clocked into the input shift register on the falling edges of

this pin.

SYNC

13

15

Digital Input

Frame Synchronization Input. When this pin goes low, data is written into the DAC's

input shift register on the falling edges of SCLK. After the 16th falling edge of SCLK, a

rising edge of SYNC causes the DAC to be updated. If SYNC is brought high before

the 15th falling edge of SCLK, the rising edge of SYNC acts as an interrupt and the

write sequence is ignored by the DAC.

VA

5

7

Supply

Power supply input. Must be decoupled to GND.

VOUTA

1

3

Analog Output

Channel A Analog Output Voltage.

VOUTB

2

4

Analog Output

Channel B Analog Output Voltage.

VOUTC

3

5

Analog Output

Channel C Analog Output Voltage.

VOUTD

4

6

Analog Output

Channel D Analog Output Voltage.

VOUTE

12

14

Analog Output

Channel E Analog Output Voltage.

VOUTF

11

13

Analog Output

Channel F Analog Output Voltage.

VOUTG

10

12

Analog Output

Channel G Analog Output Voltage.

VOUTH

9

11

Analog Output

Channel H Analog Output Voltage.

VREF1

6

8

Analog Input

Unbuffered reference voltage shared by Channels A, B, C, and D. Must be decoupled

to GND.

VREF2

7

9

Analog Input

Unbuffered reference voltage shared by Channels E, F, G, and H. Must be decoupled

to GND.

PAD(1)

—

Ground

Exposed die attach pad can be connected to ground or left floating. Soldering the pad

to the PCB offers optimal thermal performance and enhances package self-alignment

during reflow.

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