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DAC101S101CIMM データシート(PDF) 4 Page - Texas Instruments |
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DAC101S101CIMM データシート(HTML) 4 Page - Texas Instruments |
4 / 37 page 4 DAC101S101, DAC101S101-Q1 SNAS321G – JUNE 2005 – REVISED APRIL 2016 www.ti.com Product Folder Links: DAC101S101 DAC101S101-Q1 Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) All voltages are measured with respect to GND = 0V, unless otherwise specified (4) When the input voltage at any pin exceeds the power supplies (that is, less than GND, or greater than VA), the current at that pin should be limited to 10 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10 mA to two. (5) The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula PDMAX = (TJmax − TA) / θJA. The values for maximum power dissipation will be reached only when the device is operated in a severe fault condition (e.g., when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) (3) MIN MAX UNIT Supply voltage, VA 6.5 V Voltage on any input pin –0.3 (VA + 0.3) V Input current at any pin (4) 10 mA Package input current (4) 20 mA Power consumption at TA = 25°C See (5) Storage temperature, Tstg −65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) Human body model is 100 pF capacitor discharged through a 1.5 k Ω resistor. Machine model is 220 pF discharged through ZERO Ohms. 7.2 ESD Ratings DAC101S101 VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2500 V Machine Model ±250 (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.3 ESD Ratings DAC101S101-Q1 VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2500 V Machine Model ±250 |
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