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FDC2214QRGHTQ1 データシート(PDF) 5 Page - Texas Instruments

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部品番号 FDC2214QRGHTQ1
部品情報  EMI-Resistant 28-Bit,12-Bit Capacitance-to-Digital Converter
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メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
Logo TI1 - Texas Instruments

FDC2214QRGHTQ1 データシート(HTML) 5 Page - Texas Instruments

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FDC2212, FDC2214, FDC2112, FDC2114
www.ti.com
SNOSCZ5A – JUNE 2015 – REVISED JUNE 2015
Pin Functions (continued)
PIN
TYPE(1)
DESCRIPTION
NAME
NO.
IN3A
15
A
Capacitive sensor input 3 (FDC2114 / FDC2214 only)
IN3B
16
A
Capacitive sensor input 3 (FDC2114 / FDC2214 only)
DAP(2)
DAP
N/A
Connect to Ground
(2)
There is an internal electrical connection between the exposed Die Attach Pad (DAP) and the GND pin of the device. Although the DAP
can be left floating, for best performance the DAP should be connected to the same potential as the device's GND pin. Do not use the
DAP as the primary ground for the device. The device GND pin must always be connected to ground.
8 Specifications
8.1 Absolute Maximum Ratings
MIN
MAX
UNIT
VDD
Supply voltage range
5
V
Vi
Voltage on any pin
–0.3
VDD + 0.3
V
IA
Input current on any INx pin
–8
8
mA
ID
Input current on any digital pin
–5
5
mA
TJ
Junction temperature
–55
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
8.2 ESD Ratings
VALUE
UNIT
FDC2112 / FDC2212 in 12-pin WSON package
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
±750
C101(2)
FDC2114 / FDC2214 in 16-pin WQFN package
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
±750
C101(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
8.3 Recommended Operating Conditions
Unless otherwise specified, all limits ensured for TA = 25°C, VDD = 3.3 V
MIN
NOM
MAX
UNIT
VDD
Supply voltage
2.7
3.6
V
TA
Operating temperature
–40
125
°C
8.4 Thermal Information
FDC2112 /
FDC2214 /
FDC2212
FDC2214
THERMAL METRIC(1)
UNIT
DNT (WSON)
RGH (WQFN)
12 PINS
16 PINS
RθJA
Junction-to-ambient thermal resistance
50
38
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Copyright © 2015, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: FDC2212 FDC2214 FDC2112 FDC2114


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