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LM20BIM7X データシート(PDF) 3 Page - Texas Instruments

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部品番号 LM20BIM7X
部品情報  DSBGA Temperature Sensor
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メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
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LM20BIM7X データシート(HTML) 3 Page - Texas Instruments

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LM20
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SNIS106Q – DECEMBER 1999 – REVISED JANUARY 2015
5 Pin Configuration and Functions
DCK Package
5-Pin SC70
(Top View)
YZR Package
4-Pin DSBGA
(Top View)
Pin Functions
PIN
TYPE
DESCRIPTION
NAME
DSBGA
SC70
Device substrate and die attach paddle, connect to power supply negative
GND
2
GND
terminal. For optimum thermal conductivity to the PC board ground plane, pin
2 must be grounded. This pin may also be left floating.
GND
A2
5
GND
Device ground pin, connect to power supply negative terminal.
NC (pin 1) must be left floating or grounded. Other signal traces must not be
NC
A1
1
connected to this pin.
Analog
VO
B1
3
Temperature sensor analog output
Output
V+
B2
4
Power
Positive power supply pin
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
Supply Voltage
−0.2
6.5
V
Output Voltage
−0.6
(V+ + 0.6 )
V
Output Current
10
mA
Input Current at any pin(3)
5
mA
Maximum Junction Temperature (TJMAX)
150
°C
Storage temperature, Tstg
−65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
Soldering process must comply with TI's Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging.
(3)
When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > V
+), the current at that pin should be limited to 5 mA.
Copyright © 1999–2015, Texas Instruments Incorporated
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