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LM2575HVEP データシート(PDF) 8 Page - Texas Instruments |
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LM2575HVEP データシート(HTML) 8 Page - Texas Instruments |
8 / 28 page OBSOLETE LM2575EP, LM2575HVEP SNVS301B – DECEMBER 2004 – REVISED APRIL 2013 www.ti.com ALL OUTPUT VOLTAGE VERSIONS ELECTRICAL CHARACTERISTICS (1) Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating Temperature Range. Unless otherwise specified, VIN = 12V for the 3.3V, 5V, and Adjustable version, VIN = 25V for the 12V version, and VIN = 30V for the 15V version. ILOAD = 200 mA. LM2575-XXEP Units LM2575HV-XXEP Symbol Parameter Conditions Typ (Limits) Limit (2) DEVICE PARAMETERS Ib Feedback Bias Current VOUT = 5V (Adjustable Version Only) 50 100/500 nA fO Oscillator Frequency See (3) 52 kHz 47/42 kHz(Min) 58/63 kHz(Max) VSAT Saturation Voltage IOUT = 1A (4) 0.9 V 1.2/1.4 V(Max) DC Max Duty Cycle (ON) See (5) 98 % 93 %(Min) ICL Current Limit Peak Current (4)(3) 2.2 A 1.7/1.3 A(Min) 3.0/3.2 A(Max) IL Output Leakage (6) (7) Output = 0V 2 mA(Max) Current Output = −1V 7.5 mA Output = −1V 30 mA(Max) IQ Quiescent Current See (6) 5 mA 10 mA(Max) ISTBY Standby Quiescent ON /OFF Pin = 5V (OFF) 50 μA Current 200 μA(Max) θJA Thermal Resistance KC Package, Junction to Ambient (8) 65 θJA KC Package, Junction to Ambient (9) 45 °C/W θJC KC Package, Junction to Case 2 θJA N Package, Junction to Ambient (10) 85 θJA DW Package, Junction to Ambient (10) 100 θJA KTT Package, Junction to Ambient (11) 37 (1) "Testing and other quality control techniques are used to the extent deemed necessary to ensure product performance over the specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters may not necessarily be tested. In the absence of specific PARAMETRIC testing, product performance is assured by characterization and/or design." (2) All limits ensured at room temperature (standard type face) and at temperature extremes (bold type face). All room temperature limits are 100% production tested. All limits at temperature extremes are specified via correlation using standard Statistical Quality Control (SQC) methods. (3) The oscillator frequency reduces to approximately 18 kHz in the event of an output short or an overload which causes the regulated output voltage to drop approximately 40% from the nominal output voltage. This self protection feature lowers the average power dissipation of the IC by lowering the minimum duty cycle from 5% down to approximately 2%. (4) Output (pin 2) sourcing current. No diode, inductor or capacitor connected to output pin. (5) Feedback (pin 4) removed from output and connected to 0V. (6) Feedback (pin 4) removed from output and connected to +12V for the Adjustable, 3.3V, and 5V versions, and +25V for the 12V and 15V versions, to force the output transistor OFF. (7) VIN = 40V (60V for the high voltage version). (8) Junction to ambient thermal resistance (no external heat sink) for the 5 lead TO-220 package mounted vertically, with ½ inch leads in a socket, or on a PC board with minimum copper area. (9) Junction to ambient thermal resistance (no external heat sink) for the 5 lead TO-220 package mounted vertically, with ½ inch leads soldered to a PC board containing approximately 4 square inches of copper area surrounding the leads. (10) Junction to ambient thermal resistance with approximately 1 square inch of pc board copper surrounding the leads. Additional copper area will lower thermal resistance further. See thermal model in Switchers made Simple software. (11) If the DDPAK package is used, the thermal resistance can be reduced by increasing the PC board copper area thermally connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA is 37°C/W; and with 1.6 or more square inches of copper area, θJA is 32°C/W. 8 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: LM2575EP LM2575HVEP |
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