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LM2940QML データシート(PDF) 3 Page - Texas Instruments

部品番号 LM2940QML
部品情報  1A Low Dropout Regulator
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メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
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LM2940QML データシート(HTML) 3 Page - Texas Instruments

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LM2940QML, LM2940QML-SP
www.ti.com
SNVS389B – MAY 2010 – REVISED MAY 2013
Absolute Maximum Ratings
(1)
Input Voltage (Survival Voltage
≤ 100mS)
60V
Internal Power Dissipation with no heat sink (TA = +25°C)
(2)
1W
Maximum Junction Temperature
150°C
Storage Temperature Range
−65°C ≤ TA ≤ +150°C
Lead Temperature (Soldering 10 seconds)
300°C
16LD CFP "WG" (device 01, 02) (Still Air)
122°C/W
16LD CFP "GW" (device 03, 04) (Still Air)
136°C/W
θJA
16LD CFP "WG" (device 01, 02) (500LF/Min Air flow)
77°C/W
Thermal Resistance
16LD CFP "GW" (device 03, 04) (500LF/Min Air flow)
87°C/W
16LD CFP "WG" (device 01, 02)(3)
5°C/W
θJC
16LD CFP "GW" (device 03, 04)
13°C/W
Package Weight CFP "WG" (device 01, 02)
360 mg
Package Weight CFP "GW" (device 03, 04)
410 mg
ESD Susceptibility(4)
4KV
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For specified specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2)
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
θJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax - TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. With heat sinking,
the maximum power is 5 Watts, but then this will depend upon the temperature of the heat sink, the efficiency of the heat sink, and the
efficiency of the heat flow between the package body and the heat sink. We can not predict these values.
(3)
The package material for these devices allows much improved heat transfer over our standard ceramic packages. In order to take full
advantage of this improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either
metal traces on, or thermal vias through, the printed circuit board. Without this additional heat sinking, device power dissipation must be
calculated using
θJA, rather than θJC, thermal resistance. It must not be assumed that the device leads will provide substantial heat
transfer out of the package, since the thermal resistance of the lead frame material is very poor, relative to the material of the package
base. The stated
θJC thermal resistance is for the package material only, and does not account for the additional thermal resistance
between the package base and the printed circuit board. The user must determine the value of the additional thermal resistance and
must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device.
(4)
Human body model, 1.5 k
Ω in series with 100 pF.
Recommended Operating Conditions
(1)
Input Voltage
26V
Temperature Range
−55°C ≤ TA ≤ 125°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For specified specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
Copyright © 2010–2013, Texas Instruments Incorporated
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Product Folder Links: LM2940QML LM2940QML-SP


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