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LM3528 データシート(PDF) 3 Page - Texas Instruments

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部品番号 LM3528
部品情報  High Efficiency, Multi Display LED Driver
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メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
Logo TI1 - Texas Instruments

LM3528 データシート(HTML) 3 Page - Texas Instruments

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LM3528
www.ti.com
SNVS513B – AUGUST 2008 – REVISED MAY 2013
Absolute Maximum Ratings
(1) (2) (3)
VIN
−0.3V to 6V
VSW, VOVP,
−0.3V to 25V
VSUB/FB, VMAIN
−0.3V to 23V
VSCL, VSDA, VRESET\GPIO, VIO , VSET
−0.3V to 6V
Continuous Power Dissipation
Internally Limited
Junction Temperature (TJ-MAX)
+150°C
Storage Temperature Range
-65°C to +150°C
Maximum Lead Temperature (Soldering, 10s)(4)
+300°C
ESD Rating(5)
Human Body Model
2.5kV
(1)
Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the
device is intended to be functional, but device parameter specifications may not be ensured. For ensured specifications and test
conditions, see the Electrical Characteristics.
(2)
If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3)
All voltages are with respect to the potential at the GND pin.
(4)
For detailed soldering specifications and information, please refer to Texas Instruments Application Note 1112: DSBGA Wafer LEvel
Chip Scale Package (SNVA009).
(5)
The human body model is a 100pF capacitor discharged through 1.5k
Ω resistor into each pin. (MIL-STD-883 3015.7).
Operating Ratings
(1) (2)
VIN
2.5V to 5.5V
VSW, VOVP,
0V to 23V
VSUB/FB, VMAIN
0V to 21V
Junction Temperature Range (TJ)
(3)
-40°C to +110°C
Ambient Temperature Range (TA)
(4)
-40°C to +85°C
(1)
Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the
device is intended to be functional, but device parameter specifications may not be ensured. For ensured specifications and test
conditions, see the Electrical Characteristics.
(2)
All voltages are with respect to the potential at the GND pin.
(3)
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=+150°C (typ.) and
disengages at TJ=+140°C (typ.).
(4)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP
= +105°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of
the part/package in the application (
θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).
Thermal Properties
Junction to Ambient Thermal Resistance (
θJA)
(1)
68°C/W
(1)
Junction-to-ambient thermal resistance (
θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set
forth in the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 114.3mm x 76.2mm x 1.6mm. The ground
plane on the board is 113mm x 75mm. Thickness of copper layers are 71.5µm/35µm/35µm/71.5µm (2oz/1oz/1oz/2oz). Ambient
temperature in simulation is 22°C, still air. Power dissipation is 1W. For more information on these topics, please refer to Texas
Instruments Application Note 1112 SNVA009, and JEDEC Standard JESD51-7.
Electrical Characteristics
Specifications in standard type face are for TA = 25°C and those in boldface type apply over the Operating Temperature
Range of TA = −40°C to +85°C. Unless otherwise specified VIN = 3.6V, VIO = 1.8V, VRESET/GPIO = VIN, VSUB/FB = VMAIN = 0.5V,
R
SET
= 12.0k
Ω, OLED = ‘0’, ENM = ENS = ‘1’, BSUB = BMAIN = Full Scale.
(1) (2)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
ILED
Output Current Regulation
UNI = ‘0’, or ‘1’,
18.5
20
22
MAIN or SUB/FB Enabled
2.5V < VIN < 5.5V
Maximum Current Per
RSET = 8.0kΩ
30
mA
Current Sink
(1)
All voltages are with respect to the potential at the GND pin.
(2)
Min and Max limits are ensured by design, test, or statistical analysis. Typical (Typ) numbers are not ensured, but represent the most
likely norm.
Copyright © 2008–2013, Texas Instruments Incorporated
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