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LM3537 データシート(PDF) 4 Page - Texas Instruments |
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LM3537 データシート(HTML) 4 Page - Texas Instruments |
4 / 33 page LM3537 SNVS634B – JUNE 2011 – REVISED MAY 2013 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) (2) (3) VIN_A, VIN_B , VIN_C pin voltage -0.3V to 6.0V Voltage on Logic Pins (SCL, SDA, GPO1, GPO2, HWEN, PWM) -0.3V to (VIN_A+0.3V) with 6.0V max LED driver (D1 to D8) Pin Voltages -0.3V to (VOUT+0.3V) with 6.0V max Voltage on All Other Pins -0.3V to (VIN_A +0.3V) with 6.0V max Continuous Power Dissipation(4) Internally Limited Junction Temperature (TJ-MAX) 150°C Storage Temperature Range -40°C to +150°C ESD Rating(5) Human Body Model 2 kV (1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is specified. Operating Ratings do not imply specified performance limits. For specified performance limits and associated test conditions, see the Electrical Characteristics tables. (2) All voltages are with respect to the potential at the GND pins. (3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 160°C (typ.) and disengages at TJ = 155°C (typ.). (5) The human body model is a 100 pF capacitor discharged through a 1.5 k Ω resistor into each pin. (MIL-STD-883 3015.7) OPERATING RATINGS (1) (2) VIN_A, VIN_B Input Voltage Range 2.7V to 5.5V LED Voltage Range 2.0V to 4.0V VIN_C Input Voltage Range (Note: must stay > VOUTLDO + 0.3V) 1.8V to VIN_B Junction Temperature (TJ) Range −30°C to +110°C Ambient Temperature (TA) Range (3) −30°C to +85°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is specified. Operating Ratings do not imply specified performance limits. For specified performance limits and associated test conditions, see the Electrical Characteristics tables. (2) All voltages are with respect to the potential at the GND pins. (3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 110°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). THERMAL PROPERTIES (1) Junction-to-Ambient Thermal Resistance ( θJA), YFQ Package (2) 45°C/W (1) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (2) Junction-to-ambient thermal resistance is highly dependent on application and board layout. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. For more information, please refer to Texas Instruments' Application Note AN-1112: DSBGA Wafer Level Chip Scale Package (Literature Number SNVA009). 4 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM3537 |
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