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LM3557 データシート(PDF) 3 Page - Texas Instruments |
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LM3557 データシート(HTML) 3 Page - Texas Instruments |
3 / 19 page LM3557 www.ti.com SNVS338B – NOVEMBER 2004 – REVISED FEBRUARY 2013 Operating Conditions (1) (2) Junction Temperature (TJ) Range −40°C to +125°C Ambient Temperature (TA) Range −40°C to +85°C Supply Voltage, VIN Pin 2.7V to 7.5V En Pin 0V to VIN +0.4V (1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical characteristic specifications do not apply when operating the device outside of its rated operating conditions. (2) All voltages are with respect to the potential at the GND pin. THERMAL CHARACTERISTICS (1) (2) over operating free-air temperature range (unless otherwise noted) Junction-to-Ambient Thermal 55°C/W Resistance ( θJA), WSON Package (1) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. See Thermal Properties for the thermal resistance. The maximum allowable power dissipation at any ambient temperature is calculated using: PD(MAX) = (TJ(MAX) – TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature. (2) Junction-to-ambient thermal resistance ( θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the JEDEC standard JESD51-7. The test board is a 4 layer FR-4 board measuring 102 mm x 76 mm x 1.6 mm with a 2 x 1 array of thermal vias. The ground plane on the board is 50 mm x 50 mm. Thickness of copper layers are 36 µm/18 µm/18 µm/36 µm (1.5 oz/1 oz/1 oz/1.5 oz). Ambient temperature in simulation is 22°C, still air. Power dissipation is 1W. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues. For more information on these topics, please refer to Application Note 1187: Leadless Leadframe Package (LLP) and the Layout Guidelines section of this datasheet. Electrical Characteristics (1) (2) Limits in standard typeface are for TJ = 25°C. Limits in bold typeface apply over the full operating junction temperature range ( −40°C ≤ TJ ≤ +125°C). Unless otherwise specified: VIN = 3.6V. Parameter Test Conditions Min Typ Max Units VIN Input Voltage 2.7 7.5 V IQ Quiescent Current VEN = 0V (Shutdown) 0.01 2 µA VEN = 1.8V; VOVP = 27V 0.55 0.8 mA (Non-Switching) En Device Enable Threshold Device On 0.9 0.3 V Device Off ICL Power Switch Current Limit (3) VIN = 3V 0.4 0.8 1.1 A 0.55 0.8 1.02 RDS(ON) Power Switch ON Resistance ISw1 = 175 mA 800 1000 m Ω TC (RDS(ON)) RDS(ON) Temperature Coefficient 0.5 %/C OVP Over-Voltage Protection (4) On Threshold 22 26 28.5 V Off Threshold 21.5 25.5 28 UVP Under-Voltage Protection (4) On Threshold 2.2 V Off Threshold 2.3 IOVP Over-Voltage Protection Pin Bias 4 10 µA Current (5) IEN Enable Pin Bias Current (5) VEN = 1.8V 0.8 3 µA FS Switching Frequency VIN = 3V 0.9 1.25 1.6 MHz VFb-Sw2 Feedback Pin Voltage (6) 0.459 0.51 0.561 V IFb Feedback Pin Bias Current (5) 0.03 2 µA DMAX Maximum Duty Cycle VIN = 3V 85 90 % (1) All voltages are with respect to the potential at the GND pin. (2) Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm. (3) The Power Switch Current Limit is tested in open loop configuration. For closed loop application current limit please see the Current Limit vs Temperature performance graph. (4) The on threshold indicates that the LM3557 is no longer switching or regulating LED current, while the off threshold indicates normal operation. (5) Current flows into the pin. (6) Feedback pin voltage is with respect to the voltage at the Sw2 pin. Copyright © 2004–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM3557 |
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