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LM2796 データシート(PDF) 3 Page - Texas Instruments |
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LM2796 データシート(HTML) 3 Page - Texas Instruments |
3 / 16 page LM2796 www.ti.com SNVS273A – MAY 2004 – REVISED MAY 2013 ABSOLUTE MAXIMUM RATINGS (1) (2) (3) VIN pin voltage -0.3V to 7.1V EN, ENA, ENB pin voltages -0.3V to (VIN+0.3V)w/ 5.6V max Continuous Power Dissipation(4) Internally Limited Junction Temperature (TJ-MAX) 150ºC Storage Temperature Range -65ºC to +150º C Maximum Lead Temperature (Soldering, 10 sec.) 265ºC ESD Rating(5) Human Body Model 2.0kV Machine Model 200V (1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is specified. Operating Ratings do not imply specified performance limits. For specified performance limits and associated test conditions, see the Electrical Characteristics tables. (2) All voltages are with respect to the potential at the GND pin. (3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 160°C (typ.) and disengages at TJ = 120°C (typ.). The thermal shutdown function is specified by design. (5) The Human body model is a 100pF capacitor discharged through a 1.5k resistor into each pin. The machine model is a 200pF capacitor discharged directly into each pin. MIL-STD-883 3015.7 OPERATING RATING (1) (2) Input Voltage Range 2.7V to 5.5V Junction Temperature (TJ) Range -30°C to +125°C Ambient Temperature (TA) Range (3) -30°C to +85°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is specified. Operating Ratings do not imply specified performance limits. For specified performance limits and associated test conditions, see the Electrical Characteristics tables. (2) All voltages are with respect to the potential at the GND pin. (3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). THERMAL PROPERTIES Juntion-to-Ambient Thermal Resistance ( θJA) (1) 100°C/W (1) Junction-to-ambient thermal resistance is highly dependent on application and board layout. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. Copyright © 2004–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM2796 |
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同様の説明 - LM2796_16 |
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