データシートサーチシステム |
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LM3704 データシート(PDF) 4 Page - Texas Instruments |
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LM3704 データシート(HTML) 4 Page - Texas Instruments |
4 / 18 page - - = q J A J A T (MAX) T P(MAX) 4 LM3704 SNVS088F – MAY 2004 – REVISED APRIL 2016 www.ti.com Product Folder Links: LM3704 Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, θJ-A, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using: Where the value of θJ-A for the 10-pin VSSOP package is 195°C/W in a typical printed-circuit board (PCB) mounting and the DSBGA package is 220°C/W. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage, VCC –0.3 6 V All other inputs –0.3 VCC + 0.3 V Power dissipation See(2) Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1500 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±150 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT TA Free-air temperature –40 85 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) LM3704 UNIT DGS (VSSOP) 10 PINS RθJA Junction-to-ambient thermal resistance 163.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 58.3 °C/W RθJB Junction-to-board thermal resistance 83.5 °C/W ψJT Junction-to-top characterization parameter 6 °C/W ψJB Junction-to-board characterization parameter 82.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W |
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同様の説明 - LM3704 |
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