データシートサーチシステム
  Japanese  ▼
ALLDATASHEET.JP

X  

LM4960 データシート(PDF) 9 Page - Texas Instruments

部品番号 LM4960
部品情報  Piezoelectric Speaker Driver
Download  20 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
Logo TI1 - Texas Instruments

LM4960 データシート(HTML) 9 Page - Texas Instruments

Back Button LM4960 Datasheet HTML 5Page - Texas Instruments LM4960 Datasheet HTML 6Page - Texas Instruments LM4960 Datasheet HTML 7Page - Texas Instruments LM4960 Datasheet HTML 8Page - Texas Instruments LM4960 Datasheet HTML 9Page - Texas Instruments LM4960 Datasheet HTML 10Page - Texas Instruments LM4960 Datasheet HTML 11Page - Texas Instruments LM4960 Datasheet HTML 12Page - Texas Instruments LM4960 Datasheet HTML 13Page - Texas Instruments Next Button
Zoom Inzoom in Zoom Outzoom out
 9 / 20 page
background image
LM4960
www.ti.com
SNAS221C – OCTOBER 2004 – REVISED MAY 2013
For the LQA28A,
θJA = 59°C/W. TJMAX = 125°C for the LM4960. Depending on the ambient temperature, TA, of
the system surroundings, Equation (5) can be used to find the maximum internal power dissipation supported by
the IC packaging. If the result of Equation (4) is greater than that of Equation (5), then either the supply voltage
must be increased, the load impedance increased or TA reduced. For the typical application of a 3V power
supply, with V1 set to 12V and a 800nF + 20
Ω load, the maximum ambient temperature possible without violating
the maximum junction temperature is approximately 118°C provided that device operation is around the
maximum power dissipation point. Thus, for typical applications, power dissipation is not an issue. Power
dissipation is a function of output power and thus, if typical operation is not around the maximum power
dissipation
point,
the
ambient
temperature
may
be
increased
accordingly.
Refer
to
the
TYPICAL
PERFORMANCE CHARACTERISTICS curves for power dissipation information for lower output levels.
EXPOSED-DAP PACKAGE PCB MOUNTING CONSIDERATIONS
The LM4960’s exposed-DAP (die attach paddle) package (WQFN) provides a low thermal resistance between
the die and the PCB to which the part is mounted and soldered. The low thermal resistance allows rapid heat
transfer from the die to the surrounding PCB copper traces, ground plane, and surrounding air. The WQFN
package should have its DAP soldered to a copper pad on the PCB. The DAP’s PCB copper pad may be
connected to a large plane of continuous unbroken copper. This plane forms a thermal mass, heat sink, and
radiation area. Further detailed and specific information concerning PCB layout, fabrication, and mounting a
WQFN package is found in Texas Instruments' Package Engineering Group under application note SNOA401.
SHUTDOWN FUNCTION
In many applications, a microcontroller or microprocessor output is used to control the shutdown circuitry to
provide a quick, smooth transition into shutdown. Another solution is to use a single-pole, single-throw switch,
and a pull-up resistor. One terminal of the switch is connected to GND. The other side is connected to the two
shutdown pins and the terminal of the pull-up resistor. The remaining resistance terminal is connected to VDD. If
the switch is open, then the external pull-up resistor connected to VDD will enable the LM4960. This scheme
ensures that the shutdown pins will not float thus preventing unwanted state changes.
PROPER SELECTION OF EXTERNAL COMPONENTS
Proper selection of external components in applications using integrated power amplifiers, and switching DC-DC
converters, is critical for optimizing device and system performance. Consideration to component values must be
used to maximize overall system quality.
The best capacitors for use with the switching converter portion of the LM4960 are multi-layer ceramic
capacitors. They have the lowest ESR (equivalent series resistance) and highest resonance frequency, which
makes them optimum for high frequency switching converters.
When selecting a ceramic capacitor, only X5R and X7R dielectric types should be used. Other types such as
Z5U and Y5F have such severe loss of capacitance due to effects of temperature variation and applied voltage,
they may provide as little as 20% of rated capacitance in many typical applications. Always consult capacitor
manufacturer’s data curves before selecting a capacitor. High-quality ceramic capacitors can be obtained from
Taiyo-Yuden, AVX, and Murata.
POWER SUPPLY BYPASSING
As with any amplifier, proper supply bypassing is critical for low noise performance and high power supply
rejection. The capacitor location on both V1 and VDD pins should be as close to the device as possible.
SELECTING INPUT CAPACITOR FOR AUDIO AMPLIFIER
One of the major considerations is the closedloop bandwidth of the amplifier. To a large extent, the bandwidth is
dictated by the choice of external components shown in Figure 2. The input coupling capacitor, Ci, forms a first
order high pass filter which limits low frequency response. This value should be chosen based on needed
frequency response for a few distinct reasons.
High value input capacitors are both expensive and space hungry in portable designs. Clearly, a certain value
capacitor is needed to couple in low frequencies without severe attenuation. But ceramic speakers used in
portable systems, whether internal or external, have little ability to reproduce signals below 100Hz to 150Hz.
Thus, using a high value input capacitor may not increase actual system performance.
Copyright © 2004–2013, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Links: LM4960


同様の部品番号 - LM4960

メーカー部品番号データシート部品情報
logo
National Semiconductor ...
LM4960 NSC-LM4960 Datasheet
348Kb / 12P
   Piezoelectric Speaker Driver
LM4960SQ NSC-LM4960SQ Datasheet
348Kb / 12P
   Piezoelectric Speaker Driver
More results

同様の説明 - LM4960

メーカー部品番号データシート部品情報
logo
National Semiconductor ...
LM4960 NSC-LM4960 Datasheet
348Kb / 12P
   Piezoelectric Speaker Driver
logo
Rohm
BU64562GWZ ROHM-BU64562GWZ Datasheet
721Kb / 24P
   Piezoelectric Actuator Driver
logo
R & E International, In...
RE46C100 RANDE-RE46C100 Datasheet
42Kb / 3P
   Piezoelectric Horn Driver Circuit
logo
Microchip Technology
RE46C100 MICROCHIP-RE46C100 Datasheet
124Kb / 4P
   Piezoelectric Horn Driver Circuit
2009
RE46C100 MICROCHIP-RE46C100_14 Datasheet
631Kb / 18P
   Piezoelectric Horn Driver Circuit
03/25/14
logo
Sanyo Semicon Device
LV8071LP SANYO-LV8071LP Datasheet
71Kb / 6P
   Piezoelectric Actuator Driver IC
logo
Texas Instruments
LM4962 TI1-LM4962_14 Datasheet
926Kb / 23P
[Old version datasheet]   Ceramic Speaker Driver
logo
National Semiconductor ...
LM4962 NSC-LM4962 Datasheet
1Mb / 22P
   Ceramic Speaker Driver
logo
Texas Instruments
LM4961 TI1-LM4961_14 Datasheet
1Mb / 23P
[Old version datasheet]   Ceramic Speaker Driver
logo
National Semiconductor ...
LM4961 NSC-LM4961 Datasheet
509Kb / 16P
   Ceramic Speaker Driver
More results


Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20


データシート ダウンロード

Go To PDF Page


リンク URL




プライバシーポリシー
ALLDATASHEET.JP
ALLDATASHEETはお客様のビジネスに役立ちますか?  [ DONATE ] 

Alldatasheetは   |   広告   |   お問い合わせ   |   プライバシーポリシー   |   リンク交換   |   メーカーリスト
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com