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SN74LV32ADGVR データシート(PDF) 5 Page - Texas Instruments |
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SN74LV32ADGVR データシート(HTML) 5 Page - Texas Instruments |
5 / 28 page SN74LV32A www.ti.com SCLS385K – SEPTEMBER 1997 – REVISED DECEMBER 2014 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage 2 5.5 V VCC = 2 V 1.5 VCC = 2.3 to 2.7 V VCC × 0.7 VIH High-level input voltage V VCC = 3 V to 3.6 V VCC × 0.7 VCC = 4.5 V to 5.5 V VCC × 0.7 VCC = 2 V 0.5 VCC = 2.3 to 2.7 V VCC × 0.3 VIL Low-level input voltage V VCC = 3 V to 3.6 V VCC × 0.3 VCC = 4.5 V to 5.5 V VCC × 0.3 VI Input voltage 0 5.5 V VO Output voltage 0 VCC V VCC = 2 V –50 µA VCC = 2.3 to 2.7 V –2 IOH High-level output current VCC = 3 V to 3.6 V –6 mA VCC = 4.5 V to 5.5 V –12 VCC = 2 V 50 µA VCC = 2.3 to 2.7 V 2 IOL Low-level output current VCC = 3 V to 3.6 V 6 mA VCC = 4.5 V to 5.5 V 12 VCC = 2.3 to 2.7 V 200 ∆t/∆v Input transition rise or fall rate VCC = 3 V to 3.6 V 100 ns/V VCC = 4.5 V to 5.5 V 20 TA Operating free-air temperature –40 125 °C (1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004). 7.4 Thermal Information SN74LV32A THERMAL METRIC(1) D DBV DVG NS PW RGY UNIT 14 PINS RθJA Junction-to-ambient thermal resistance 90.6 107.1 129.0 90.7 122.6 57.5 RθJC(top) Junction-to-case (top) thermal resistance 50.9 59.6 52.1 48.3 51.4 70.8 RθJB Junction-to-board thermal resistance 44.8 54.4 62.0 49.4 64.4 33.6 Junction-to-top characterization ψJT 14.7 20.5 6.5 14.6 6.7 3.4 °C/W parameter Junction-to-board characterization ψJB 44.5 53.8 61.3 49.1 63.8 33.7 parameter Junction-to-case (bottom) thermal RθJC(bot) — — — — — 13.9 resistance (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953). Copyright © 1997–2014, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: SN74LV32A |
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