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LMP91002 データシート(PDF) 4 Page - Texas Instruments |
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LMP91002 データシート(HTML) 4 Page - Texas Instruments |
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4 / 31 page  LMP91002 SNIS163B – APRIL 2012 – REVISED OCTOBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings See (1) (2) (3) MIN MAX UNIT Voltage between any two pins 6 V Current through VDD or VSS 50 mA Current sunk and sourced by CE pin 10 mA Current out of other pins(4) 5 mA Junction temperature(5) 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) For soldering specifications, see SNOA549. (3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (4) All non-power pins of this device are protected against ESD by snapback devices. Voltage at such pins will rise beyond absmax if current is forced into pin. (5) The maximum power dissipation is a function of TJ(MAX), θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ θJA All numbers apply for packages soldered directly onto a PCB. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000 Electrostatic V(ESD) Charged-device model (CDM), per JEDEC specification JESD22-C101(3) ±1000 V discharge Machine Model (MM) ±200 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC) Field- Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). (3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions MIN MAX UNIT Supply voltage VS = (VDD - AGND) 2.7 3.6 V Temperature(1) –40 85 °C (1) The maximum power dissipation is a function of TJ(MAX), θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ θJA All numbers apply for packages soldered directly onto a PCB. 6.4 Thermal Information LMP91002 THERMAL METRIC(1) NHL (WSON) UNIT 14 PINS RθJA Junction-to-ambient thermal resistance (2) 44 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) The maximum power dissipation is a function of TJ(MAX), θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ θJA All numbers apply for packages soldered directly onto a PCB. 4 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: LMP91002 |
同様の部品番号 - LMP91002_16 |
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同様の説明 - LMP91002_16 |
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