データシートサーチシステム |
|
LMR14030SDDA データシート(PDF) 4 Page - Texas Instruments |
|
|
LMR14030SDDA データシート(HTML) 4 Page - Texas Instruments |
4 / 30 page LMR14030 SNVSA81A – FEBRUARY 2015 – REVISED APRIL 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VIN, EN to GND -0.3 44 BOOT to GND -0.3 49 Input Voltages SS to GND -0.3 5 V FB to GND -0.3 7 RT/SYNC to GND -0.3 3.6 BOOT to SW 6.5 Output Voltages V SW to GND -3 44 TJ Junction temperature -40 150 °C Tstg Storage temperature -65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings PARAMETER DEFINITION VALUE UNIT Human body model (HBM)(1) 2 Electrostatic V(ESD) kV discharge Charged device model (CDM)(2) 0.5 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN 4 40 VOUT 0.8 28 Buck Regulator BOOT 45 V SW -1 40 FB 0 5 EN 0 40 Control RT/SYNC 0 3.3 V SS 0 3 Switching frequency range at RT mode 200 2500 Frequency kHz Switching frequency range at SYNC mode 250 2300 Temperature Operating junction temperature, TJ -40 125 °C 7.4 Thermal Information DDA THERMAL METRIC(1) UNIT 8 PINS RθJA Junction-to-ambient thermal resistance 42.5 ψJT Junction-to-top characterization parameter 9.9 ψJB Junction-to-board characterization parameter 25.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 56.1 RθJC(bot) Junction-to-case (bottom) thermal resistance 3.8 RθJB Junction-to-board thermal resistance 25.5 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: LMR14030 |
同様の部品番号 - LMR14030SDDA |
|
同様の説明 - LMR14030SDDA |
|
|
リンク URL |
プライバシーポリシー |
ALLDATASHEET.JP |
ALLDATASHEETはお客様のビジネスに役立ちますか? [ DONATE ] |
Alldatasheetは | 広告 | お問い合わせ | プライバシーポリシー | リンク交換 | メーカーリスト All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |