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データシートサーチシステム |
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データシートサーチシステム |
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TLC27L9CDR データシート(PDF) 4 Page - Texas Instruments |
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TLC27L9CDR データシート(HTML) 4 Page - Texas Instruments |
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4 / 43 page  TLC27L4, TLC27L4A, TLC27L4B, TLC27L4Y, TLC27L9 LinCMOS ™ PRECISION QUAD OPERATIONAL AMPLIFIERS SLOS053C – OCTOBER 1987 – REVISED AUGUST 1994 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLC27L4Y chip information These chips, when properly assembled, display characteristics similar to the TLC27L4C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (11) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + – 1OUT 1IN + 1IN – VDD (4) (6) (3) (2) (5) (1) – + (7) 2IN + 2IN – 2OUT (11) GND + – 3OUT 3IN + 3IN – (13) (10) (9) (12) (8) – + (14) 4OUT 4IN + 4IN – 68 108 (1) (2) (3) (4) (5) (6) (7) (8) (9) (10) (11) (12) (13) (14) |
同様の部品番号 - TLC27L9CDR |
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同様の説明 - TLC27L9CDR |
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