データシートサーチシステム |
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TLC2810ZDR データシート(PDF) 2 Page - Texas Instruments |
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TLC2810ZDR データシート(HTML) 2 Page - Texas Instruments |
2 / 23 page TLC2810Z, TLC2810Y LinCMOS ™ PRECISION DUAL OPERATIONAL AMPLIFIERS SLOS120A – AUGUST 1993 – REVISED AUGUST 1994 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLC2810Y chip information This chip, when properly assembled, displays characteristics similar to the TLC2810Z. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJmax = 165°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (4) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + – 1OUT 1IN + 1IN – VDD GND (8) (1) (3) (2) (4) BONDING PAD ASSIGNMENTS + – 2OUT 2IN + 2IN – (7) (5) (6) (1) (2) (3) (4) (5) (6) (7) (8) 72 59 |
同様の部品番号 - TLC2810ZDR |
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同様の説明 - TLC2810ZDR |
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