uA78M05, uA78M06, uA78M08

uA78M09, uA78M10, uA78M12, uA78M33

SLVS059T – JUNE 1976 – REVISED JANUARY 2015

www.ti.com

7 Specifications

7.1 Absolute Maximum Ratings

over virtual junction temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input voltage

35

V

Operating virtual junction temperature

150

°C

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

2500

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101,

2000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN

MAX

UNIT

uA78M33

5.3

25

uA78M05

7

25

uA78M06

8

25

uA78M08

10.5

25

Input voltage

V

uA78M09

11.5

26

uA78M10

12.5

28

uA78M12

14.5

30

uA78M15

17.5

30

Output current

500

mA

uA78MxxC

0

125

Operating virtual junction temperature

°C

uA78MxxI

–40

125

7.4 Thermal Information

UA78Mxx

DCY

KC

KCS

KTP

KVU

UNIT

3 PINS

3 PINS

3 PINS

3 PINS

3 PINS

Junction-to-ambient thermal resistance

53

19

19

28

30.3

Junction-to-case (top) thermal resistance

30.6

17

17

19

—

p)

°C/W

Junction-to-case (bottom) thermal resistance

—

3

3

1.4

—

ot)

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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