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UC3826 データシート(PDF) 5 Page - Texas Instruments |
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UC3826 データシート(HTML) 5 Page - Texas Instruments |
5 / 12 page 5 UC1826 UC2826 UC3826 ENBL: The active low input with a 2.5V threshold en- ables the output to switch. SEQ and RUN are driven low when ENBL is above its 2.5V threshold. GND: The signal ground used for the voltage sense am- plifier, current error amplifier, current error amplifier, volt- age reference, 2X amplifier, and share amplifier. The output sink transistor is wired directly to this pin. KILL: The active low input with a 3.0V threshold stops the output from switching. Once this function is activated RUN must be cycled low by driving KILL above 3.0V and either resetting the power to the chip (VCC) or resetting the ENBL signal. ILIM: A voltage on this pin programs the voltage error amplifier’s Voh clamp. The voltage error amplifier output represents the average output current. The Voh clamp consequently limits the output current. If ILIM is tied to VREF, it defaults to 3.0V. A voltage less than 3.0V con- nected to ILIM clamps the voltage error amplifier at this voltage and consequently limits the maximum output cur- rent. OSC:The oscillator ramp (not to be confused with PWM ramp) pin has a capacitor CT to ground and two resistors in series RT and RDEAD to VREF. The total resistance of RT and RDEAD divided by VREF – VOSC sets exponential charge current. The oscillator charges from 1.2V to 3.4V until the output transitions low. At this time an open col- lector transistor is turned on and discharges the CT ca- pacitor through RDEAD. The charge time is approximately TCHARGE = 2(RT + RDEAD)•CT when the RDEAD resistor is used. The dead time is approximately TDISCHARGE =2 • RDEAD • CT. () 1 1 Frequency TT CHARGE DISCHARGE ≈ + () 2 Maximum Duty Cycle T TT CHARGE CHARGE DISCHARGE ≈ + The CT capacitance should be increased by approxi- mately 40pF to account for parasitic capacitance. OUT: The output of the PWM driver. It has an upper clamp of 8.5V. The peak current sink and source are 250mA. All UVLO, SEQ, ENBL, and KILL logic either en- able or disable the output driver. PWRSEN: This pin is the input to the PWROK compara- tor. PWROK: The output pin from the PWROK comparator. It has a 300 A current source output when driven high. RAMP: An open collector that can sink 20mA to dis- charge the oscillator capacitor. An RC is tied between VCC and GND to accomplish feedforward. The PWM output drives this pin. When the output is high, the tran- sistor is off enabling the charging of the RAMP capacitor. When the output transitions low, the transistor is turned on discharging the RAMP capacitor. The voltage at RAMP rises from 0.2V to near 4V at maximum duty cy- cle. Although this is an exponential ramp at high VCC voltage the ramp appears linear. RDEAD: The pin that programs the maximum duty cycle by connecting a resistor between it and OSC. The maxi- mum duty cycle is decreased by increasing this resistor value which increases the discharge time. The dead time, the time when the output is low, is 2 • RDEAD • CT. The CT capacitance should be increased by approximately 40pF to account for parasitic capacitance. RUN: This is an open collector logic output that signifies when the chip is operational. RUN is pulled high to VREF through an external resistor when VCC is greater than 8.4V, VREF is greater than 4.65V, SEQ is greater than 2.5V, and KILL lower than 3.0V. RUN connected to the VA+ pin and to a capacitor to ground adds an RC rise time on the VA+ pin initiating a soft start. SEQ: The sequence pin allows the sequencing of startup for multiple units. A resistor between VREF and SEQ and a capacitor between SEQ and GND create a unique RC rise time for each unit which sequences the output startup. SHARE:The nearly DC voltage representing the average output current. This pin is wired directly to all SHARE pins and is the load share bus. VA–, VA+: The inverting and non-inverting inputs to the voltage error amplifier. VAO: The output of the voltage error amplifier. Its Voh is clamped with the ILIM pin. VCC: The input voltage to the chip. The chip is opera- tional between 8.4V and 20V. VEE: The negative supply voltage to the chip which pow- ers the lower voltage rail for all amplifiers. The chip is op- erational if VEE is connected to GND or if GND is floating. When voltage is applied externally to VEE, GND becomes a virtual ground because of an internal diode between VEE and GND. The GND current flows through the forward biased diode and out VEE. GND is always the signal ground from which the voltage reference and all amplifier inputs are referenced. VREF: The reference voltage equal to 5.0V. PIN DESCRIPTIONS (cont.) |
同様の部品番号 - UC3826 |
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同様の説明 - UC3826 |
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