TLV2332, TLV2332Y, TLV2334, TLV2334Y

LinCMOS

™ LOW-VOLTAGE MEDIUM-POWER

OPERATIONAL AMPLIFIERS

SLOS189 – FEBRUARY 1997

2

POST OFFICE BOX 655303

description (continued)

These amplifiers offer a level of ac performance greater than that of many other devices operating at

comparable power levels. The TLV233x operational amplifiers are especially well suited for use in low-current

or battery-powered applications.

Low-voltage and low-power operation has been made possible by using the Texas Instruments silicon-gate

LinCMOS

™ technology. The LinCMOS process also features extremely high input impedance and ultra-low bias

currents making these amplifiers ideal for interfacing to high-impedance sources such as sensor circuits or filter

applications.

To facilitate the design of small portable equipment, the TLV233x is made available in a wide range of package

options, including the small-outline and thin-shrink small-outline package (TSSOP). The TSSOP package has

significantly reduced dimensions compared to a standard surface-mount package. Its maximum height of only

1.1 mm makes it particularly attractive when space is critical.

The device inputs and outputs are designed to withstand –100-mA currents without sustaining latch-up. The

TLV233x incorporates internal ESD-protection circuits that prevents functional failures at voltages up to

2000 V as tested under MIL-STD 883C, Method 3015.2; however, care should be exercised in handling these

devices as exposure to ESD may result in the degradation of the device parametric performance.

TLV2332Y chip information

This chip, when properly assembled, display characteristics similar to the TLV2332. Thermal compression or

ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive

epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 MILS TYPICAL

BONDING PADS: 4

× 4 MILS MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

PIN (4) IS INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

+

–

1OUT

1IN +

1IN –

VDD

VDD – / GND

(8)

(6)

(3)

(2)

(5)

(1)

–

+

(7)

2IN +

2IN –

2OUT

(4)

59

72

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)