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TLV73318PQDRVRQ1 データシート(PDF) 11 Page - Texas Instruments

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部品番号 TLV73318PQDRVRQ1
部品情報  Capacitor-Free, 300-mA, Low Dropout (LDO) Linear Regulator
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メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
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120·R
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11
TLV733P-Q1
www.ti.com
SBVS283A – AUGUST 2016 – REVISED AUGUST 2016
Product Folder Links: TLV733P-Q1
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
7.3 Feature Description
7.3.1 Undervoltage Lockout (UVLO)
The TLV733P-Q1 family uses an undervoltage lockout (UVLO) circuit that disables the output until the input
voltage is greater than the rising UVLO voltage. This circuit ensures that the device does not exhibit any
unpredictable behavior when the supply voltage is lower than the operational range of the internal circuitry.
During UVLO disable, the output is connected to ground with a 120-Ω pulldown resistor.
7.3.2 Shutdown
The enable pin (EN) is active high. Enable the device by forcing the EN pin to exceed VEN(HI) (0.9 V, minimum).
Turn off the device by forcing the EN pin to drop below 0.35 V. If shutdown capability is not required, connect EN
to IN.
The TLV733P-Q1 has an internal pulldown MOSFET that connects a 120-Ω resistor to ground when the device is
disabled. The discharge time after disabling depends on the output capacitance (COUT) and the load resistance
(RL) in parallel with the 120-Ω pulldown resistor. The time constant is calculated in Equation 1:
(1)
7.3.3 Internal Foldback Current Limit
The TLV733P-Q1 has an internal foldback current limit that protects the regulator during fault conditions. The
current allowed through the device is reduced when the output voltage falls. When the output is shorted, the LDO
supplies a typical current of 150 mA. The output voltage is not regulated when the device is in current limit. In
this condition, the output voltage is the product of the regulated current and the load resistance. When the device
output is shorted, the PMOS pass transistor dissipates power [(VIN – VOUT) × IOS] until thermal shutdown is
triggered and the device turns off. After the device cools down, the internal thermal shutdown circuit turns the
device back on. If the fault condition continues, the device cycles between current limit and thermal shutdown;
see the Thermal Information table for more details.
The foldback current-limit circuit limits the current allowed through the device to current levels lower than the
minimum current limit at a nominal VOUT current limit (ILIM) during startup. See Figure 6 to Figure 8 for typical
foldback current limit values. If the output is loaded by a constant-current load during startup, or if the output
voltage is negative when the device is enabled, then the load current demanded by the load can exceed the
foldback current limit and the device may not rise to the full output voltage. For constant-current loads, disable
the output load until the TLV733P-Q1 has fully risen to the nominal output voltage.
The TLV733P-Q1 PMOS pass element has an intrinsic body diode that conducts current when the voltage at the
OUT pin exceeds the voltage at the IN pin. Do not force the output voltage to exceed the input voltage because
excessively high current can flow through the body diode.
7.3.4 Thermal Shutdown
Thermal shutdown protection disables the output when the junction temperature rises to approximately 160°C.
Disabling the device eliminates the power dissipated by the device, allowing the device to cool. When the
junction temperature cools to approximately 140°C, the output circuitry is again enabled. Depending on power
dissipation, thermal resistance, and ambient temperature, the thermal protection circuit can cycle on and off. This
cycling limits regulator dissipation, protecting the device from damage as a result of overheating.
Activating the thermal shutdown feature usually indicates excessive power dissipation as a result of the product
of the (VIN – VOUT) voltage and the load current. For reliable operation, limit junction temperature to 135°C
(maximum). To estimate the margin of safety in a complete design, increase the ambient temperature until the
thermal protection is triggered; use worst-case loads and signal conditions.
The TLV733P-Q1 internal protection circuitry protects against overload conditions but is not intended to be
activated in normal operation. Continuously running the TLV733P-Q1 into thermal shutdown degrades device
reliability.


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