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ORDERING INFORMATION

ABSOLUTE MAXIMUM RATINGS

RECOMMENDED OPERATING CONDITIONS

PACKAGE DISSIPATION RATINGS

TPA2032D1

TPA2033D1

TPA2034D1

SLOS476 – JUNE 2006

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

PACKAGE

PART NUMBER

SYMBOL

–40

°C to 85°C

Wafer chip scale packaging – Lead free (YZF)

BPX

–40

°C to 85°C

Wafer chip scale packaging – Lead free (YZF)

BPY

–40

°C to 85°C

Wafer chip scale packaging – Lead free (YZF)

BPZ

(1)

The YZF package is only available taped and reeled. To order add the suffix R to the end of the part number for a reel of 3000, or add

the suffix T to the end of the part number for a reel of 250 (e.g. TPA2032D1YZFR).

TPA2032D1, TPA2033D1,

TPA2034D1

In active mode

–0.3 V to 6 V

Supply voltage

In SHUTDOWN mode

–0.3 V to 7 V

Input voltage

Continuous total power dissipation

See Dissipation Rating Table

Operating free-air temperature

–40

°C to 85°C

Operating junction temperature

–40

°C to 125°C

Storage temperature

–65

°C to 150°C

ESD

2KV

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The output pins Vo– and Vo+ are tolerant to 1.5KV HBM ESD

MIN

NOM

MAX

UNIT

Supply voltage

2.5

5.5

V

High-level input voltage

SHUTDOWN

1.3

V

Low-level input voltage

SHUTDOWN

0

0.35

V

0.5

V

Operating free-air temperature

–40

85

°C

DERATING FACTOR

PACKAGE

(1 /

θ

POWER RATING

POWER RATING

POWER RATING

YZF

4.8 mW/

480 mW

264 mW

192 mW

YZF

7.5 mW/

750 mW

412 mW

300 mW

(1)

Derating factor measured with JEDEC Low-K board; 1S0P - One signal layer and zero plane layers.

(2)

Derating factor measured with JEDEC High K board; 1S2P - One signal layer and two plane layers.

Please see JEDEC Standard 51-3 for Low-K board, JEDEC Standard 51-7 for High-K board, and JEDEC Standard 51-12 for using

package thermal information.

Please see JEDEC document page for downloadable copies: http://www.jedec.org/download/default.cfm.

2

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