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TPS25942A データシート(PDF) 5 Page - Texas Instruments |
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TPS25942A データシート(HTML) 5 Page - Texas Instruments |
5 / 54 page TPS25942A, TPS25942L, TPS25944A, TPS25944L www.ti.com SLVSCE9A – JUNE 2014 – REVISED MARCH 2015 8 Specifications 8.1 Absolute Maximum Ratings over operating temperature range (unless otherwise noted) (1) VALUE UNIT MIN MAX IN, OUT, PGTH, PGOOD, EN, OVP, DMODE, FLT –0.3 20 IN (10 ms Transient) 22 Input voltage range V dVdT, ILIM –0.3 3.6 IMON –0.3 7 Sink current PGOOD, FLT, dVdT 10 mA Source current dVdT, ILIM, IMON Internally Limited Maximum junction, TJ –40 150 °C Storage temperature range, Tstg –65 150 °C Continuous power dissipation See the Thermal Characteristics (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 8.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001s(1) ±2000 VESD Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22- ±500 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 8.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT IN 2.7 18 EN, OVP, DMODE, OUT, PGTH, PGOOD, FLT 0 18 Input voltage range V dVdT, ILIM 0 3 IMON 0 6 ILIM 16.9 150 Resistance k Ω IMON 1 OUT 0.1 µF External capacitance dVdT 470 nF Operating junction temperature range, TJ –40 25 125 °C 8.4 Thermal Characteristics TPS25942, 44 THERMAL METRIC(1) UNIT RVC (20) PINS RθJA Junction-to-ambient thermal resistance 38.1 RθJCtop Junction-to-case (top) thermal resistance 40.5 RθJB Junction-to-board thermal resistance 13.6 °C/W ψJT Junction-to-top characterization parameter 0.6 ψJB Junction-to-board characterization parameter 13.7 RθJCbot Junction-to-case (bottom) thermal resistance 3.4 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TPS25942A TPS25942L TPS25944A TPS25944L |
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