PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

5962-8682501EA

ACTIVE

CDIP

J

16

1

None

Call TI

Level-NC-NC-NC

5962-8875901EA

ACTIVE

CDIP

J

16

1

None

Call TI

Level-NC-NC-NC

CD54HC173F

ACTIVE

CDIP

J

16

1

None

Call TI

Level-NC-NC-NC

CD54HC173F3A

ACTIVE

CDIP

J

16

1

None

Call TI

Level-NC-NC-NC

CD54HCT173F3A

ACTIVE

CDIP

J

16

1

None

Call TI

Level-NC-NC-NC

CD74HC173E

ACTIVE

PDIP

N

16

25

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

CD74HC173M

ACTIVE

SOIC

D

16

40

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD74HC173M96

ACTIVE

SOIC

D

16

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD74HC173MT

ACTIVE

SOIC

D

16

250

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD74HC173NSR

ACTIVE

SO

NS

16

2000

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD74HC173PW

ACTIVE

TSSOP

PW

16

90

Pb-Free

(RoHS)

CU NIPDAU

Level-1-250C-UNLIM

CD74HC173PWR

ACTIVE

TSSOP

PW

16

2000

Pb-Free

(RoHS)

CU NIPDAU

Level-1-250C-UNLIM

CD74HC173PWT

ACTIVE

TSSOP

PW

16

250

Pb-Free

(RoHS)

CU NIPDAU

Level-1-250C-UNLIM

CD74HCT173E

ACTIVE

PDIP

N

16

25

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

CD74HCT173M

ACTIVE

SOIC

D

16

40

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD74HCT173M96

ACTIVE

SOIC

D

16

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD74HCT173MT

ACTIVE

SOIC

D

16

250

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

product content details.

None: Not yet available Lead (Pb-Free).

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,

including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

PACKAGE OPTION ADDENDUM

www.ti.com

28-Feb-2005

Addendum-Page 1