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MC100EP56DTR2G データシート(PDF) 3 Page - ON Semiconductor

部品番号 MC100EP56DTR2G
部品情報  ECL Dual Differential 2:1 Multiplexer
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メーカー  ONSEMI [ON Semiconductor]
ホームページ  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

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MC10EP56, MC100EP56
http://onsemi.com
3
Table 3. ATTRIBUTES
Characteristics
Value
Value
Internal Input Pulldown Resistor
75 k
W
Internal Input Pullup Resistor
N/A
ESD Protection
Human Body Model
Machine Model
Charged Device Model
> 2 kV
> 150 V
> 2 kV
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Pb Pkg
Pb−Free Pkg
SOIC
TSSOP
QFN
Level 1
Level 1
N/A
Level 3
Level 3
Level 1
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Transistor Count
140 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 4. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Mode Power Supply
VEE = 0 V
6
V
VEE
NECL Mode Power Supply
VCC = 0 V
−6
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI  VCC
VI  VEE
6
−6
V
V
Iout
Output Current
Continuous
Surge
50
100
mA
mA
IBB
VBB Sink/Source
± 0.5
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
20 TSSOP
20 TSSOP
140
100
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
20 TSSOP
23 to 41
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
20 SOIC
20 SOIC
90
60
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
20 SOIC
33 to 35
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
QFN−20
QFN−20
47
33
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
QFN−20
18
°C/W
Tsol
Wave Solder
Pb
Pb−Free
<2 to 3 sec @ 248
°C
<2 to 3 sec @ 260
°C
265
265
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.


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