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LM2614BTLX データシート(PDF) 4 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
部品番号 LM2614BTLX
部品情報  400mA Sub-Miniature Adjustable DC-DC Converter Optimized for RF Power Amplifiers
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メーカー  NSC [National Semiconductor (TI)]
ホームページ  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM2614BTLX データシート(HTML) 4 Page - National Semiconductor (TI)

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Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
PVIN, VDD to SGND
−0.2V to +6V
PGND to SGND, PVIN to VDD
−0.2V to +0.2V
EN, EAOUT, EANEG, SYNC/MODE
to SGND
−0.2V to +6V
FB, SW
(GND −0.2V) to
(VDD +0.2V)
Storage Temperature Range
−45˚C to +150˚C
Lead Temperature
(Soldering, 10 sec.)
260˚C
Junction Temperature (Note 2)
−25˚C to +125˚C
Minimum ESD Rating
±2kV
(Human Body Model, C = 100 pF, R = 1.5 k
Ω)
Thermal Resistance (
θ
JA) (Note 3)
140˚C/W
Electrical Characteristics
Specifications with standard typeface are for T
A =TJ = 25˚C, and those in boldface type apply over the full Operating Tem-
perature Range of T
A =TJ = −25˚C to +85˚C. Unless otherwise specified, PVIN = VDD = EN = SYNC/MODE = 3.6V.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
V
IN
Input Voltage Range
PVIN = VDD = V
IN (Note 4)
2.8
3.6
5.5
V
V
FB
Feedback Voltage
1.485
1.50
1.515
V
V
HYST
PFM Comparator Hysteresis
Voltage
PFM Mode (SYNC/MODE =
0V) (Note 5)
24
mV
I
SHDN
Shutdown Supply Current
VIN = 3.6V, EN = 0V
0.02
3
µA
I
Q1_PWM
DC Bias Current into VDD
SYNC/MODE = VIN
FB=2V
600
725
µA
I
Q2_PFM
SYNC/MODE = 0V
FB=2V
160
195
µA
R
DSON (P)
Pin-Pin Resistance for
P FET
395
550
m
R
DSON (N)
Pin-Pin Resistance for
N FET
330
500
m
R
DSON (TC)
FET Resistance
Temperature Coefficient
0.5
%/C
I
LIM
Switch Peak Current Limit
(Note 6)
LM2614ATL
510
690
850
mA
LM2614BTL
400
690
980
V
IH
Logic High Input, EN,
SYNC/MODE
0.95
1.3
V
V
IL
Logic Low Input, EN,
SYNC/MODE
0.4
0.80
V
F
SYNC
SYNC/MODE Clock
Frequency Range
(Note 7)
500
1000
kHz
F
OSC
Internal Oscillator
Frequency
LM2614ATL, PWM Mode
468
600
732
kHz
LM2614BTL, PWM Mode
450
600
750
T
min
Minimum ON-Time of PFET
Switch in PWM Mode
200
ns
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but device specifications may not be guaranteed. For guaranteed specifications and associated test conditions, see the Min and Max limits and Conditions
in the Electrical Characteristics table. Typical (typ) specifications are mean or average values at 25˚C and are not guaranteed.
Note 2: Thermal shutdown will occur if the junction temperature exceeds 150˚C.
Note 3: Thermal resistance specified with 2 layer PCB (0.5/0.5 oz. cu).
Note 4: The LM2614 is designed for mobile phone applications where turn-on after system power-up is controlled by the system controller. Thus, it should be kept
in shutdown by holding the EN pin low until the input voltage exceeds 2.8V.
Note 5: The hysteresis voltage is the minimum voltage swing on the FB pin that causes the internal feedback and control circuitry to turn the internal PFET switch
on and then off during PFM mode. When resistor dividers are used like in the operating circuit of Figure 4, the hysteresis at the output will be the value of the
hysteresis at the feedback pin times the resistor divider ratio. In this case, 24mV (typ) x ((46.4k + 33.2k)/33.2k).
Note 6: Current limit is built-in, fixed, and not adjustable. If the current limit is reached while the voltage at the FB pin is pulled below 0.7V, the internal PFET switch
turns off for 2.5µs to allow the inductor current to diminish.
Note 7: SYNC driven with an external clock switching between VIN and GND. When an external clock is present at SYNC; the IC is forced to be in PWM mode at
the external clock frequency. The LM2614 synchronizes to the rising edge of the external clock.
www.national.com
4


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