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LM2647MTCX データシート(PDF) 7 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
部品番号 LM2647MTCX
部品情報  Dual Synchronous Buck Regulator Controller
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メーカー  NSC [National Semiconductor (TI)]
ホームページ  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM2647MTCX データシート(HTML) 7 Page - National Semiconductor (TI)

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Electrical Characteristics (Continued)
Specifications with standard typeface are for T
J = 25˚C, and those with boldface apply over full Operating Junction Tempera-
ture range. VDD = V5 = 5V, V
SGND =VPGND = 0V, VIN = 15V, VEN = 3V, RFADJ = 22.1K unless otherwise stated. (Note 5)
Symbol
Parameter
Conditions
Min
(Note 6)
Typical
(Note 7)
Max
(Note 6)
Units
V
SW_ZERO
Zero-cross Threshold (SW
Pin)
LDRV goes low
-2.2
mV
Osillator
PWM Frequency
R
FADJ = 22.1k
255
300
345
kHz
R
FADJ = 12.4k
500
R
FADJ = 30.9k
200
PWM Ramp Peak-to-peak
Amplitude
VIN = 15V
1.6
V
VIN = 24V
2.95
PWM Ramp Valley
0.8
V
Frequency Change with VIN
VIN = 5.5V to 24V
±1%
Frequency Change with VDD
VDD = 4.5V to 5.5V
±2%
Phase Shift Between
Channels
Phase from HDRV1 to HDRV2
165
180
195
deg
FREQ Pin Voltage vs. VIN
0.105
V/V
System
Minimum ON Time
V
FPWM =3V
30
ns
VIN = 5.5V
60
75
%
Maxmimum Duty Cycle
VIN = 15V
40
50
%
VIN = 28V, VDD= 4.5V
22
28
%
Gate Drivers
HDRV Source Impedance
HDRV Pin Current (sourcing)= 1.2A
7
HDRV Sink Impedance
HDRV Pin Current (sinking) = 1A
2
LDRV Source Impedance
LDRV Pin Current (sourcing) =
1.2A
7
LDRV Sink Impedance
LDRV Pin Current (sinking) = 2A
1
Cross-conduction protection
delay (deadtime)
HDRV Falling to LDRV Rising
40
ns
LDRV Falling to HDRV Rising
70
Note 1: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the
device is guaranteed. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics table.
Note 2: PGND1, PGND2 and SGND are all electrically connected together on the PCB.
Note 3: The maximum allowable power dissipation is calculated by using PDmax =(TJMAX -TA)/θJA , where TJMAX is the maximum junction temperature, TA is the
ambient temperature, and
θJA is the junction-to-ambient thermal resistance of the specified package. The 1.0W rating of the TSSOP-28 package for example results
from using 125˚C, 25˚C, and 97˚C/W for TJMAX,TA, and θJA respectively. The 2.85W rating of the 28-pin LLP package results from using 125˚C, 25˚C, and 35˚C/W
for TJMAX,TA, and θJA respectively. The rated power dissipation should be derated by 10mW/˚C above 25˚C ambient for the TSSOP package and 29mW/˚C above
25˚C ambient for the LLP package. The
θJA value above represents the worst-case condition with no heat sinking. Heat sinking will permit more power to be
dissipated at higher ambient temperatures. For detailed information on soldering plastic TSSOP and LLP packages, refer to http://www.national.com/packaging/.
Note 4: ESD is applied by the human body model, which is a 100pF capacitor discharged through a 1.5 k
Ω resistor into each pin.
Note 5: RFADJ is the frequency adjust resistor between FREQ pin and Ground.
Note 6: All limits are guaranteed at room temperature (standard face type) and at temperature extremes (bold face type). All room temperature limits are 100%
production tested. All limits at temperature extremes are guaranteed via correlation using Statistical Quality Control (SQC) methods. All limits are used to calculate
Average Outgoing Quality Level (AOQL).
Note 7: Typical numbers are at 25˚C and represent the most likely norm.
Note 8: If the LM2647 starts up with a pre-charged soft start capacitor, it will first discharge the capacitor to VSS_RESET and then begin the normal Soft-start process.
www.national.com
7


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