MC74VHCT126A

www.onsemi.com

2

Figure 1. LOGIC DIAGRAM

Active−High Output Enables

Y1

Y2

Y4

3

6

8

11

13

12

10

9

4

5

1

2

A1

OE1

A2

OE2

A3

OE3

A4

OE4

Y3

11

12

13

14

8

9

10

5

4

3

2

1

7

6

OE3

Y4

A4

OE4

Y3

A3

OE2

Y1

A1

OE1

GND

Y2

A2

Figure 2. PIN ASSIGNMENT

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

DC Supply Voltage

– 0.5 to + 7.0

V

DC Input Voltage

– 0.5 to + 7.0

V

DC Output Voltage

Output in 3−State

High or Low State

– 0.5 to + 7.0

V

Input Diode Current

− 20

mA

± 20

mA

DC Output Current, per Pin

± 25

mA

± 75

mA

Power Dissipation in Still Air,

SOIC Packages†

TSSOP Package†

500

450

mW

Storage Temperature

– 65 to + 150

_C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of

these limits are exceeded, device functionality should not be assumed, damage may occur and

reliability may be affected.

†Derating — SOIC Packages: – 7 mW/

_C from 65_ to 125_C

TSSOP Package: − 6.1 mW/

_C from 65_ to 125_C

RECOMMENDED OPERATING CONDITIONS

Parameter

Symbol

Min

Max

Unit

DC Supply Voltage

4.5

5.5

V

DC Input Voltage

0

5.5

V

DC Output Voltage

Output in 3−State

High or Low State

0

0

5.5

V

Operating Temperature

− 40

+ 85

_C

Input Rise and Fall Time

0

20

ns/V

Functional operation above the stresses listed in the Recommended Operating Ranges is not

implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may

affect device reliability.

This device contains protection

circuitry to guard against damage

due to high static voltages or electric

fields. However, precautions must

be taken to avoid applications of any

voltage higher than maximum rated

voltages to this high−impedance cir-

range GND

Unused inputs must always be

tied to an appropriate logic voltage

Unused outputs must be left open.