データシートサーチシステム |
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7440650022 データシート(PDF) 5 Page - Texas Instruments |
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7440650022 データシート(HTML) 5 Page - Texas Instruments |
5 / 40 page 5 LM53602, LM53603 www.ti.com SNVSAR0 – NOVEMBER 2016 Product Folder Links: LM53602 LM53603 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) See System Characteristics for details of input voltage range. (2) Under no conditions should the output voltage be allowed to fall below zero volts. (3) An extended output voltage range to 10 V is possible with changes to the typical application schematic. Also, some system specifications are not achieved for output voltages greater than 6 V. Consult the factory for further information. (4) High junction temperatures degrade operating lifetimes. Operating lifetime is de-rated for junction temperatures greater than 125°C. 7.3 Recommended Operating Conditions over the recommended operating junction temperature range of –40°C to 150°C (unless otherwise noted) MIN NOM MAX UNIT Input voltage(1) 3.9 36 V Output voltage : fixed 5 V(2) 0 5 V Output voltage : fixed 3.3 V(2) 0 3.3 V Output voltage adjustment range: ADJ(2)(3) 3.3 10 V Output current for LM53603 0 3 A Output current for LM53602 0 2 A RESET pin current 0 1 mA Operating junction temperature(4) –40 150 °C (1) The values given in this table are only valid for comparison with other packages and cannot be used for design purposes. These values were calculated in accordance with JESD 51-7, and simulated on a 4-layer JEDEC board. They do not represent the performance obtained in an actual application. For design information please see the Maximum Ambient Temperature section. For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report and the Using New Thermal Metrics (SBVA025) application report. 7.4 Thermal Information THERMAL METRIC(1) LM53603, LM53602 UNIT PWP (HTSSOP) 16 PINS RθJA Junction-to-ambient thermal resistance 42.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 22.6 °C/W RθJB Junction-to-board thermal resistance 16.2 °C/W ψJT Junction-to-top characterization parameter 0.6 °C/W ψJB Junction-to-board characterization parameter 16.0 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 1.1 °C/W |
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同様の説明 - 7440650022 |
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