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UC1825A-SP データシート(PDF) 5 Page - Texas Instruments |
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UC1825A-SP データシート(HTML) 5 Page - Texas Instruments |
5 / 40 page 5 UC1825A-SP www.ti.com SLUS873C – JANUARY 2009 – REVISED DECEMBER 2016 Product Folder Links: UC1825A-SP Submit Documentation Feedback Copyright © 2009–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VIN Supply voltage VC, VCC 22 V IO Source or sink current, DC OUTA, OUTB 0.5 A IO Source or sink current, pulse (0.5 μs) OUTA, OUTB 2.2 A Analog inputs INV, NI, RAMP –0.3 to 7 V ILIM, SS –0.3 to 6 V Power ground PGND ±0.2 V Outputs OUTA, OUTB PGND – 0.3 to VC + 0.3 V ICLK Clock output current CLK/LEB –5 mA IO(EA) Error amplifier output current EAOUT 5 mA ISS Soft-start sink current SS 20 mA IOSC Oscillator charging current RT –5 mA TJ Operating virtual junction temperature –55 150 °C Lead temperature 1.6 mm (1/16 inch) from cases for 10 seconds 300 °C Tstg Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V 7.3 Recommended Operating Conditions over operating free-air temperature range (TA = TJ = –55°C to 125°C), unless otherwise noted MIN MAX UNIT VCC Supply voltage 12 20 V Sink/source output current (continuous or time average) 0 100 mA Reference load current 0 10 mA (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 7.4 Thermal Information THERMAL METRIC(1) UC1825A-SP UNIT J (CDIP) 16 PINS RθJA Junction-to-ambient thermal resistance 55.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance N/A °C/W RθJB Junction-to-board thermal resistance 33.3 °C/W ψJT Junction-to-top characterization parameter 10.3 °C/W ψJB Junction-to-board characterization parameter 35.89 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 8.024 °C/W |
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