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UC1825A-SP データシート(PDF) 5 Page - Texas Instruments

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部品番号 UC1825A-SP
部品情報  Class-V, Radiation Hardened High-Speed PWM Controller
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メーカー  TI1 [Texas Instruments]
ホームページ  http://www.ti.com
Logo TI1 - Texas Instruments

UC1825A-SP データシート(HTML) 5 Page - Texas Instruments

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UC1825A-SP
www.ti.com
SLUS873C – JANUARY 2009 – REVISED DECEMBER 2016
Product Folder Links: UC1825A-SP
Submit Documentation Feedback
Copyright © 2009–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VIN
Supply voltage
VC, VCC
22
V
IO
Source or sink current, DC
OUTA, OUTB
0.5
A
IO
Source or sink current,
pulse (0.5 μs)
OUTA, OUTB
2.2
A
Analog inputs
INV, NI, RAMP
–0.3
to 7
V
ILIM, SS
–0.3
to 6
V
Power ground
PGND
±0.2
V
Outputs
OUTA, OUTB
PGND – 0.3
to VC + 0.3
V
ICLK
Clock output current
CLK/LEB
–5
mA
IO(EA)
Error amplifier output
current
EAOUT
5
mA
ISS
Soft-start sink current
SS
20
mA
IOSC
Oscillator charging current
RT
–5
mA
TJ
Operating virtual junction temperature
–55
150
°C
Lead temperature 1.6 mm (1/16 inch) from cases for 10 seconds
300
°C
Tstg
Storage temperature
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±4000
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (TA = TJ = –55°C to 125°C), unless otherwise noted
MIN
MAX
UNIT
VCC
Supply voltage
12
20
V
Sink/source output current (continuous or time average)
0
100
mA
Reference load current
0
10
mA
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
7.4 Thermal Information
THERMAL METRIC(1)
UC1825A-SP
UNIT
J (CDIP)
16 PINS
RθJA
Junction-to-ambient thermal resistance
55.6
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
N/A
°C/W
RθJB
Junction-to-board thermal resistance
33.3
°C/W
ψJT
Junction-to-top characterization parameter
10.3
°C/W
ψJB
Junction-to-board characterization parameter
35.89
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
8.024
°C/W


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