TPS2660 datasheet(5/49 Pages) TI1

部品番号	TPS2660

部品情報	60-V, 2-A Industrial eFuse with Integrated Reverse Input Polarity Protection

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5

TPS2660

www.ti.com

SLVSDG2A – JULY 2016 – REVISED AUGUST 2016

Product Folder Links: TPS2660

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (all voltages referred to GND (unless otherwise noted))

(1)

MIN

MAX

UNIT

IN , IN-OUT

Input voltage

–60

60

V

IN , IN-OUT (10 msec transient), TA = 25 °C

–70

70

V

[IN, OUT, FLT, UVLO, SHDN] to RTN

–0.3

60

V

[OVP, dVdT, ILIM, IMON, MODE] to RTN

–0.3

5

V

RTN

–60

0.3

V

IFLT, IdVdT, ISHDN

Sink current

10

mA

IdVdT, IILIM, IIMON

Source current

Internally limited

TJ

Operating junction temperature

–40

150

°C

Transient junction temperature

–65

T(TSD)

°C

Tstg

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±250

7.3 Recommended Operating Conditions

over operating free-air temperature range (all voltages referred to GND (unless otherwise noted))

MIN

NOM

MAX

UNIT

IN

Input voltage

–55

55

V

UVLO, OUT, FLT

0

55

OVP, dVdT, ILIM, IMON, SHDN

0

4

ILIM

Resistance

5.36

120

kΩ

IMON

1

IN, OUT

External capacitance

0.1

µF

dVdT

10

nF

– dV(IN)/dt

V(IN) falling slew rate

20

V/µs

TJ

Operating junction temperature

–40

25

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

THERMAL METRIC(1)

TPS2660

UNIT

PWP (HTSSOP)

RHF (VQFN)

16 PINS

24 PINS

RθJA

Junction-to-ambient thermal resistance

38.6

30.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

22.7

20.8

°C/W

RθJB

Junction-to-board thermal resistance

18.2

7.6

°C/W

ψJT

Junction-to-top characterization parameter

0.5

0.2

°C/W

ψJB

Junction-to-board characterization parameter

18

7.6

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

1.5

1.7

°C/W

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同様の部品番号 - TPS2660

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