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ADRF5130BCPZ データシート(PDF) 11 Page - Analog Devices |
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ADRF5130BCPZ データシート(HTML) 11 Page - Analog Devices |
11 / 11 page ADRF5130 Data Sheet Rev. A | Page 10 of 10 OUTLINE DIMENSIONS 0.50 BSC 0.50 0.40 0.30 COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-8. BOTTOM VIEW TOP VIEW 4.10 4.00 SQ 3.90 SEATING PLANE 0.90 0.85 0.80 0.05 MAX 0.02 NOM 0.20 REF COPLANARITY 0.08 PIN 1 INDICATOR 1 24 7 12 13 18 19 6 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 0.30 0.25 0.18 0.20 MIN 2.85 2.70 SQ 2.55 EXPOSED PAD PIN 1 INDIC ATOR AREA OPTIONS (SEE DETAIL A) DETAIL A (JEDEC 95) Figure 15. 24-Lead Lead Frame Chip Scale Package [LFCSP] 4 mm × 4 mm Body and 0.85 mm Package Height (CP-24-16) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range MSL Rating2 Package Description Package Option ADRF5130BCPZ −40°C to +105°C MSL3 24-Lead Lead Frame Chip Scale Package [LFCSP] CP-24-16 ADRF5130BCPZ-R7 −40°C to +105°C MSL3 24-Lead Lead Frame Chip Scale Package [LFCSP] CP-24-16 ADRF5130-EVALZ −40°C to +105°C Evaluation Board 1 Z = RoHS-Compliant Part. 2 See the Absolute Maximum Ratings section. ©2016–2017 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D14081-0-1/17(A) |
同様の部品番号 - ADRF5130BCPZ |
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同様の説明 - ADRF5130BCPZ |
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